Patents by Inventor Michael PINGERT

Michael PINGERT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microfluidic device and a method of manufacturing a microfluidic device
    Patent number: 9188991
    Abstract: A microfluidic device comprising in sequence first, second and third layers of plastics materials. A microfluidic circuit including a laterally extending microfluidic channel is formed at the interface between the first and second layers by surface structure in one or both of the first and second layers. A via is formed in the third layer for supplying or removing fluid to or from the microfluidic circuit. A conduit is formed in the second layer to provide fluid communication between the microfluidic channel and the via. A weld is formed at the interface between the second and third layers in a continuous closed path around the via and forms a fluid-tight seal for fluid flow between the via and the microfluidic circuit.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: November 17, 2015
    Assignee: Sony DADC Austria AG
    Inventors: Michael Pingert, Dario Borovic, Alfred Paris
  • MICROFLUIDIC DEVICE AND A METHOD OF MANUFACTURING A MICROFLUIDIC DEVICE
    Publication number: 20140102546
    Abstract: A microfluidic device comprising in sequence first, second and third layers of plastics materials. A microfluidic circuit including a laterally extending microfluidic channel is formed at the interface between the first and second layers by surface structure in one or both of the first and second layers. A via is formed in the third layer for supplying or removing fluid to or from the microfluidic circuit. A conduit is formed in the second layer to provide fluid communication between the microfluidic channel and the via. A weld is formed at the interface between the second and third layers in a continuous closed path around the via and forms a fluid-tight seal for fluid flow between the via and the microfluidic circuit.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 17, 2014
    Applicant: Sony DADC Austria AG
    Inventors: Michael PINGERT, Dario BOROVIC, Alfred PARIS