Abstract: An imager comprising a photosensitive surface; a light source which produces at least one scanning light beam; a deflector, arranged to deflect the at least one scanning light beam onto the photosensitive surface; and a sensor which measures the orientation of the deflector. The imager also comprises a controller operative to determine a placement error of said at least one scanning beam on the photosensitive surface, responsive to the orientation measurement by the sensor: and an actuator, responsive to the displacement error, and arranged to change the direction of deflection of the at least one light beam by the deflector. The sensor is configured to measure the orientation of the deflector substantially at a null in a vibrational mode of the deflector.

Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.

Abstract: Apparatus comprising a two-dimensional array of light sources (40) and a scanning device (26) arranged to scan light (14) emitted from the light sources (40) onto a medium (10) to generate a plurality of scan lines (52) on the medium (10), the light sources (24 and scanning device (26) being arranged such that a plurality of light sources (24) can be used to generate each scan line (52) of the plurality of scan lines (52).

Abstract: An anamorphic optical element and an adjustment mechanism for selectively rotating the optical element either around an axis substantially in a vertical direction, an axis substantially in an optical axis direction, an axis substantially in a plane formed by the vertical direction and the optical axis direction, or combination of axes thereof is used to vary a vertical separation between two or more spots.

Abstract: Laser pulses are selected from a group of closely spaced laser pulses with an optical modulator by adjusting pulse timing relative to an impingement interval. An adjusted pulse is moved from an impingement interval to a non-impingement interval and is blocked. The blocked laser source is stabilized by running nearly continuously. Pulse selection with multiple laser sources is achieved with a single acousto-optic modulator.

Abstract: Skew compensation apparatus for compensating for skew of a multi-beam scanning source, comprises: delay commencement detector(s) for detecting the start of a beam scanner position, position detectors for detecting the position of the multiple beams at a predefined interval following the commencement, so that the position indicates skew of the respective beam, and compensating electronics for automatically inserting a compensation for the skew by altering a delay into a timing signal for switching the respective beam. The commencement detector can be an existing start of scan detector and the apparatus can be built into the writing head, particularly at the conjugate location to the focal plane or at the focal plane of a laser printer or the like to provide a self-calibrating printer.

Abstract: A method of determining presence of variations in interline spacing in a first image comprising a first plurality of parallel lines of pixels comprising: providing a second image comprising a second plurality of parallel lines; orienting the images so that the lines in the first and second pluralities are superimposed and angled with respect to each other to generate an interference image comprising a Moiré interference pattern; and using the Moiré interference pattern to determine presence of said variations.

Abstract: This invention relates to a method of laser power uniformity calibration, comprising: printing a first pattern by a first laser beam; moving the first laser beam to print a second pattern such that the second pattern is located at a predetermined distance from the first pattern; printing the first and second patterns by a second laser beam; comparing the first and second patterns printed by the first and second laser beams; and optionally adjusting a power in the first and second laser beams.

Abstract: An imager comprising a photosensitive surface; a light source which produces at least one scaning light beam; a deflector, arranged to deflect the at least one scanning light beam onto the photosensitive surface; and a sensor which measures the orientation of the deflector. The imager also comprises a controller operative to determine a placement error of said at least one scanning beam on the photosensitive surface, responsive to the orientation measurement by the sensor; and an actuator, responsive to the displacement error, and arranged to change the direction of deflection of the at least one light beam by the deflector. The sensor is configured to measure the orientation of the deflector substantially at a null in a vibrational mode of the deflector.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Abstract: Skew compensation apparatus for compensating for skew of a multi-beam scanning source, comprises: delay commencement detector(s) for detecting the start of a beam scanner position, position detectors for detecting the position of the multiple beams at a predefined interval following the commencement, so that the position indicates skew of the respective beam, and compensating electronics for automatically inserting a compensation for the skew by altering a delay into a timing signal for switching the respective beam. The commencement detector can be an existing start of scan detector and the apparatus can be built into the writing head, particularly at the conjugate location to the focal plane or at the focal plane of a laser printer or the like to provide a self-calibrating printer.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: A method of determining a start of scan time in a laser scanning system utilizing a scanning reflector, comprising: directing a laser beam toward the scanning reflector so as to be reflected by the scanning reflector; returning the laser beam reflected from the scanning reflector toward the scanning reflector for at least one additional reflection from the scanning reflector; detecting the laser beam reflected at least twice from the scanning reflector; and controlling the start of scan of the scanning system, responsive to the detection of the laser beam.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.