Patents by Inventor Michael Prevallet

Michael Prevallet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Concentrated capacitor assembly
    Patent number: 8760848
    Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: June 24, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: John D. Prymak, Peter Par Blais, George Haddox, Michael Prevallet, Jim Piller, Chris Stolarski, Chris Wayne
  • CONCENTRATED CAPACITOR ASSEMBLY
    Publication number: 20120081834
    Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.
    Type: Application
    Filed: December 9, 2011
    Publication date: April 5, 2012
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: John D. Prymak, Peter Par Blais, George Haddox, Michael Prevallet, Jim Piller, Chris Stolarski, Chris Wayne
  • Concentrated capacitor assembly
    Patent number: 8125766
    Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: February 28, 2012
    Assignee: Kemet Electronics Corporation
    Inventors: John D. Prymak, Peter Blais, George Haddox, Michael Prevallet, Jim Piller, Chris Stolarski, Chris Wayne
  • Concentrated Capacitor Assembly
    Publication number: 20090310280
    Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.
    Type: Application
    Filed: June 13, 2008
    Publication date: December 17, 2009
    Inventors: John D. Prymak, Peter Blais, George Haddox, Michael Prevallet, Jim Piller, Chris Stolarski, Chris Wayne
  • Embedded capacitors and methods for their fabrication and connection
    Publication number: 20070139864
    Abstract: Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
    Type: Application
    Filed: December 21, 2005
    Publication date: June 21, 2007
    Inventors: Gregory Dunn, Remy Chelini, Robert Croswell, Philip Lessner, Michael Prevallet, John Prymak