Abstract: The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.

Abstract: The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.

Abstract: An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

Abstract: A controlled start up technique may eliminate the excessive peak junction temperature by controlling the speed of the electric device. Lower speed may result in reduced power to the load. Reduced power may result in reduced losses to maintain reliable operating junction temperatures. Once the junction reaches the predetermined temperature limit, speed may be controlled to hold the junction temperature constant. As time elapses, the coolant temperature may reduce, thereby allowing a higher power level without an increase in IGBT temperature. Unlike conventional methods which may allow for full power continuously upon start up, thereby either potentially causing a high temperature shut-down condition or requiring additional thermal inertia to handle a high heat load due to a continuous full-power start up, the controlled start up eliminates the design penalties for extensive thermal enhancements to accommodate the occasional extreme hot start up.

Abstract: A heat exchanger includes a silicon nitride substrate. Electronic components may be surface mounted to the substrate. A fluid passageway in the heat exchanger allows a coolant to flow therethrough and carry away heat from the electronic components.