Patents by Inventor Michael Quan Dinh

Michael Quan Dinh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010028554
    Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
    Type: Application
    Filed: February 6, 2001
    Publication date: October 11, 2001
    Applicant: Dallas Semiconductor Corporation
    Inventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
  • Patent number: 6191955
    Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
    Type: Grant
    Filed: January 21, 1998
    Date of Patent: February 20, 2001
    Assignee: Dallas Semiconductor Corporation
    Inventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
  • Patent number: 5749143
    Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
    Type: Grant
    Filed: August 12, 1996
    Date of Patent: May 12, 1998
    Assignee: Dallas Semiconductor Corporation
    Inventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
  • Patent number: D484628
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: December 30, 2003
    Inventors: Bijan Bayat, Michael Quan Dinh
  • Patent number: D486599
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: February 10, 2004
    Inventors: Bijan Bayat, Michael Quan Dinh
  • Patent number: D490554
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 25, 2004
    Inventors: Bijan Bayat, Michael Quan Dinh
  • Patent number: D490555
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 25, 2004
    Inventors: Bijan Bayat, Michael Quan Dinh