Abstract: The present invention provides a wiring degradation detector for use with telephone wire-pairs providing electric power. In one embodiment, the wiring degradation detector includes a transmission section configured to transmit load power over the telephone wire-pairs. Additionally, the wiring degradation detector also includes a test section coupled to the transmission section and configured to provide a load power test signal that determines a condition of the telephone wire-pairs. In an alternative embodiment, the wiring degradation detector further includes a degradation monitoring section coupled to the test section and configured to track values of the condition of the wiring over time.

Abstract: For use with a rack for supporting a first battery having first terminals and a second battery having second terminals, an interlock kit comprising a partition mount and a partition. The partition mount is couplable to the rack proximate the first battery and the second battery. The partition is coupled to the partition mount and translatable between a first battery access position that allows access to ends of the first terminals and obstructs access to the second terminals and a second battery access position that allows access to ends of the second terminals and obstructs access to the first terminals.

Abstract: The present invention provides an electromagnetic interference (EMI) module cover for use in an electronics module that is configured to house electrical components that are capable of generating electromagnetic emissions that cause EMI. In one embodiment a conductive sidepanel has a resilient cantilever member formed therefrom with a fixed end that is integrally formed with the sidepanel and a movable end that is free of a module coupler, thereby allowing the resilient cantilever member to flex as the module is installed in a chassis. The resilient cantilever member has a boss that is formed proximate to the movable free end. The boss extends outward from the sidepanel a distance sufficient to provide a conductive path between the conductive sidepanel and an adjacent conductive surface when the module is installed in the chassis.

Abstract: The present invention provides an electromagnetic interference (EMI) module cover for use in an electronics module that is configured to house electrical components that are capable of generating electromagnetic emissions that cause EMI. In one embodiment a conductive sidepanel has a resilient cantilever member formed therefrom with a fixed end that is integrally formed with the sidepanel and a movable end that is free of a module coupler, thereby allowing the resilient cantilever member to flex as the module is installed in a chassis. The resilient cantilever member has a boss that is formed proximate to the movable free end. The boss extends outward from the sidepanel a distance sufficient to provide a conductive path between the conductive sidepanel and an adjacent conductive surface when the module is installed in the chassis.

Abstract: For use with an electronic equipment chassis having a module support member adapted to receive an electronic module and having a conduit containing an electrical conductor proximate the module support member, an electromagnetic interference (EMI) cover, method of manufacturing the EMI cover and electronic equipment chassis employing the same. In one embodiment, the EMI cover includes a conductive body that substantially conforms to the conduit and a boss extending from the conductive body and configured to contact a conductive case of the electronic module. The boss provides a conductive path between the conduit and the electronic module to establish a common voltage potential therebetween thereby reducing EMI emissions associated with the electronic module.