Abstract: The transport of singulated die devices (110) is improved by utilizing condition sensitive adhesive tape (102) in a die transport system (100). Condition sensitive adhesive tape (102) is adhered to the bottom surface of a carrier plate (104) so as to cover a series of holes (106) formed in the carrier plate (104). The tape (102) is preferably heat sensitive adhesive tape (102) and may alternatively be ultraviolet light sensitive adhesive tape (102). The die transport system (100) contains die devices (110) in the carrier plate (104) by adhering the condition sensitive adhesive tape (102) to the bottom surface of the die devices (110). To release the die devices (110), the tape (102) is exposed to a certain condition in order to diminish its adhesiveness. Then, a vacuum suction force is used to pick up the die device (110) and remove it from the transport system (100).

Abstract: The transport of singulated die devices (110) is improved by utilizing condition sensitive adhesive tape (102) in a die transport system (100). Condition sensitive adhesive tape (102) is adhered to the bottom surface of a carrier plate (104) so as to cover a series of holes (106) formed in the carrier plate (104). The tape (102) is preferably heat sensitive adhesive tape (102) and may alternatively be ultraviolet light sensitive adhesive tape (102). The die transport system (100) contains die devices (110) in the carrier plate (104) by adhering the condition sensitive adhesive tape (102) to the bottom surface of the die devices (110). To release the die devices (110), the tape (102) is exposed to a certain condition in order to diminish its adhesiveness. Then, a vacuum suction force is used to pick up the die device (110) and remove it from the transport system (100).

Abstract: Disclosed is a split backed pressure sensitive die carrier tape including a flexible carrier member having a plurality of holes formed therein of a size larger than a die to be carried. Two strips of pressure sensitive adhesive tape are placed along the back face of the carrier partially covering each hole in the carrier. The two strips of substantially straight pressure sensitive tape are spaced apart so that a poke up needle can be passed between the pressure sensitive tape and through the hole formed in the carrier without tearing or damaging either strip of pressure sensitive tape. An integrated circuit chip is positioned in the hole in the carrier and secured to the pressure sensitive tapes.