Patents by Inventor Michael R. Lyon

Michael R. Lyon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967937
    Abstract: A packaged semiconductor chip includes a semiconductor sub strate having formed thereon: radio-frequency (RF) input and output contact pads, DC contact pads, and first and second amplifier stages. An input of the first amplifier stage is coupled with the RF input contact pad. An input and an output of the second amplifier stage are respectively coupled to an output of the first amplifier stage and the RF output contact pad. The DC contact pads and the input of the first amplifier stages are connected via an input bias coupling path. The outputs of the amplifier stages are connected via an output bias coupling path. The chip further includes a lead frame having RF input and output pins electrically coupled to the RF input and output contact pads, and input bias pins electrically coupled to the DC contact pad.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: April 23, 2024
    Assignee: Viasat, Inc.
    Inventors: Shih Peng Sun, Kenneth V. Buer, Michael R. Lyons, Gary P. English, Qiang R. Chen, Ramanamurthy V. Darapu, Douglas J. Mathews, Mark S. Berkheimer, Brandon C. Drake
  • Patent number: 10734960
    Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: August 4, 2020
    Assignee: Viasat, Inc.
    Inventors: Kenneth V Buer, Michael R Lyons
  • Patent number: 10224893
    Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: March 5, 2019
    Assignee: VIASAT, INC.
    Inventors: Kenneth V Buer, Michael R Lyons
  • Patent number: 10063206
    Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: August 28, 2018
    Assignee: VIASAT, INC.
    Inventors: Kenneth V Buer, Michael R Lyons
  • Patent number: 9847766
    Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: December 19, 2017
    Assignee: VIASAT, INC.
    Inventors: Kenneth V Buer, Michael R Lyons
  • Patent number: 9584089
    Abstract: A nested multi-stage polyphase filter can comprise: a first filter stage and a second filter stage. The first filter stage can be connected to the second filter stage via first through fourth intermediate connections. The first filter stage and the second filter stage can be laid out in a nested-ring layout. The first through fourth intermediate connections can be laid out so as to not cross over each other.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: February 28, 2017
    Assignee: ViaSat, Inc.
    Inventors: Qiang Richard Chen, Michael R Lyons
  • Patent number: 9484878
    Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: November 1, 2016
    Assignee: VIASAT, INC.
    Inventors: Kenneth V Buer, Michael R Lyons
  • Patent number: 9426929
    Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: August 23, 2016
    Assignee: ViaSat, Inc.
    Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel A. Lopez
  • Publication number: 20160050793
    Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
    Type: Application
    Filed: July 7, 2015
    Publication date: February 18, 2016
    Applicant: VIASAT, INC.
    Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel A. Lopez
  • Patent number: 9178515
    Abstract: The present disclosure includes systems and methods for sharing bias current. In one embodiment, shared bias current passes through a first level device to one or more second level devices along a bias current path. Multiple active devices may share bias current along a bias current path and process signal along the same or different signal paths. In one embodiment, bias current from one device is split among multiple devices. In another embodiment, bias current is combined from multiple devices into a device. Embodiments may include an interstage circuit along a signal path that improves stability of the circuit.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 3, 2015
    Assignee: VIASAT, INC.
    Inventors: Michael R Lyons, Kenneth V Buer, Qiang Richard Chen, Algirdas Navickas
  • Patent number: 9142492
    Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: September 22, 2015
    Assignee: ViaSat, Inc.
    Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel A. Lopez
  • Patent number: 8872333
    Abstract: A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: October 28, 2014
    Assignee: ViaSat, Inc.
    Inventors: Noel A Lopez, Michael R Lyons, Dave Laidig, Kenneth V Buer
  • Publication number: 20140183710
    Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
    Type: Application
    Filed: November 22, 2013
    Publication date: July 3, 2014
    Applicant: ViaSat, Inc.
    Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel A. Lopez
  • Publication number: 20140049307
    Abstract: The present disclosure includes systems and methods for sharing bias current. In one embodiment, shared bias current passes through a first level device to one or more second level devices along a bias current path. Multiple active devices may share bias current along a bias current path and process signal along the same or different signal paths. In one embodiment, bias current from one device is split among multiple devices. In another embodiment, bias current is combined from multiple devices into a device. Embodiments may include an interstage circuit along a signal path that improves stability of the circuit.
    Type: Application
    Filed: March 15, 2013
    Publication date: February 20, 2014
    Inventors: Michael R. Lyons, Kenneth V. Buer, Qiang Richard Chen
  • Patent number: 8592960
    Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: November 26, 2013
    Assignee: ViaSat, Inc.
    Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel Lopez
  • Patent number: 8384498
    Abstract: In an exemplary embodiment, a spurline filter comprises a capacitive element connected to a spur and either a through-line of the spurline filter or ground. In another embodiment, multiple capacitive elements are connected to the spur. In an exemplary embodiment, the capacitively loaded spurline filter provides a band rejection frequency response similar to the band rejection frequency response of a similar spurline filter that does not comprise at least one capacitive element but the capacitively loaded spurline filter has half the layout area or less. In an exemplary embodiment, the spurline filter comprises capacitive elements, where the capacitive elements are configured to reduce the resonant frequency of the filter.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: February 26, 2013
    Assignee: ViaSat, Inc.
    Inventors: Christopher D. Grondahl, Michael R. Lyons, Dean Lawrence Cook
  • Publication number: 20120139099
    Abstract: A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.
    Type: Application
    Filed: December 5, 2011
    Publication date: June 7, 2012
    Applicant: VIASAT, INC.
    Inventors: Noel A. Lopez, Michael R. Lyons, Dave Laidig, Kenneth V. Buer
  • Publication number: 20120051000
    Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
    Type: Application
    Filed: August 30, 2011
    Publication date: March 1, 2012
    Applicant: VIASAT, INC.
    Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel Lopez
  • Patent number: 8072065
    Abstract: A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: December 6, 2011
    Assignee: ViaSat, Inc.
    Inventors: Noel A. Lopez, Michael R. Lyons, Dave Laidig, Kenneth V. Buer
  • Publication number: 20110250861
    Abstract: A system and method for high frequency, high power operation communication systems is provided. More particularly, a system and method for a single system-on-chip system monolithic microwave integrated circuit that provides both high-frequency performance at a low cost is provided.
    Type: Application
    Filed: April 8, 2010
    Publication date: October 13, 2011
    Applicant: VIASAT, INC.
    Inventors: Michael R. Lyons, Kenneth V. Buer, Dean Lawrence Cook, Christopher D. Grondahl