Abstract: There is a method and system for efficiently computing the number of die per wafer and the corresponding number of stepper shots. In an example embodiment, dimensions for a die and the size of the wafer are received. The dimensions comprise a die element size that is a function of a scribe lane width, a guard ring width, an input/output pad area, and a length and a width of the die. A die count lookup table is selected for the specified wafer size and used to determine the die count corresponding to the die element size. In a similar manner, a stepper shot count lookup table is selected for the specified wafer size and used to determine the stepper shot count corresponding to the die element size.

Abstract: A method and system thereof for maximizing integrated circuit die production. In an example embodiment, the method is implemented on a server computer system in a client-server computer system network. In this embodiment, the server computer system receives from a client computer system a wafer size, a scribe lane width, and the dimensions for a die. A die count and a stepper shot count corresponding to the dimensions are determined using one or more lookup tables. A lookup table is associated with each combination of wafer size and scribe lane width. A measure of die production is calculated using the die count and the stepper shot count and transmitted to the client computer system. The dimensions can be changed and a new measure of die production calculated using the changed dimensions, until a maximum value of the measure of die production is determined.

Abstract: A method and system thereof for efficiently computing the number of dies per wafer and the corresponding number of stepper shot counts. Dimensions for a die and the size of the wafer are received. The dimensions comprise a die element size that is a function of a scribe lane width, a guard ring width, an input/output pad area, and a length and a width of the die. A die count lookup table is selected for the specified wafer size and used to determine the die count corresponding to the die element size. In a similar manner, a stepper shot count lookup table is selected for the specified wafer size and used to determine the stepper shot count corresponding to the die element size. The axes of the die count and stepper shot count lookup tables are incremented by varying amounts; for example, the increments in one portion of the lookup tables are smaller (finer), and in another portion the increments are larger (grosser).

Abstract: An improved method is disclosed for using a linear mixing space, such as a CIE color space, to determine the quantities of coloring agents needed to reproduce a color, applicable for example to printing a color which matches an original color on a CRT display. The calculations match hue, saturation and reflectance so that the matching color appears like the original color and so that characteristics of an original image are preserved. An original color's definition is converted into coordinates in the linear mixing space. An achromatic region in the linear mixing space, preferably elliptically shaped, is defined to include the coordinates of the neutral coloring agents. Original colors falling within the achromatic region are matched with quantities of neutral coloring agents only. The coordinates of a pure hue approximating the hue of the original color is then determined in the linear mixing space from the coordinates of selected primaries.