Abstract: Example embodiments of the present invention provide a method of manufacture and an apparatus for optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices. The method of manufacture comprise providing a plurality of compliant pin memory sockets on a first side of a circuit board at a pitch less than that specified in a reference layout requiring solder tail memory sockets and providing a plurality of surface mount capacitors on the second side of the circuit board enabling at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.

Abstract: Example embodiments of the present invention provide a method of manufacture and an apparatus for optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices. The method of manufacture comprise providing a plurality of compliant pin memory sockets on a first side of a circuit board at a pitch less than that specified in a reference layout requiring solder tail memory sockets and providing a plurality of surface mount capacitors on the second side of the circuit board enabling at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.

Abstract: A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.

Abstract: A circuit card enclosure comprises a backplane including a plurality of connectors. First and second conduction rails are thermally coupled to a heat exchanger, the first and second conduction rails each comprising an inner body at least partially encapsulated by an outer body. The inner body comprises a thermally conductive material. The outer body comprises a structural material. Card slots of the circuit card enclosure are defined between opposed card channels of the first and second conduction rails. Each card slot is constructed and arranged to register an inserted circuit card with at least one of the connectors, the card channels including a thermally conductive region constructed and arranged to thermally interface with a thermal frame of an inserted circuit card, the thermally conductive region of the card channels being thermally coupled to the inner body of the conduction rail.

Abstract: A circuit card enclosure comprises a backplane including a plurality of connectors. First and second conduction rails are thermally coupled to a heat exchanger, the first and second conduction rails each comprising an inner body at least partially encapsulated by an outer body. The inner body comprises a thermally conductive material. The outer body comprises a structural material. Card slots of the circuit card enclosure are defined between opposed card channels of the first and second conduction rails. Each card slot is constructed and arranged to register an inserted circuit card with at least one of the connectors, the card channels including a thermally conductive region constructed and arranged to thermally interface with a thermal frame of an inserted circuit card, the thermally conductive region of the card channels being thermally coupled to the inner body of the conduction rail.

Abstract: A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.