Patents by Inventor Michael R. Parent

Michael R. Parent has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for delidding a hermetically sealed circuit package
    Patent number: 11069537
    Abstract: A method of delidding an integrated circuit (IC) package includes directing a laser beam along a cut line of an integrated circuit package. The cut line defines a removable portion, the cutting occurs along the cut line, and the removable portion is removed after the directing. A method of troubleshooting an integrated circuit package is also disclosed.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: July 20, 2021
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Ali Hadjikhani, Michael R. Parent
  • METHOD FOR DELIDDING A HERMETICALLY SEALED CIRCUIT PACKAGE
    Publication number: 20210118695
    Abstract: A method of delidding an integrated circuit (IC) package includes directing a laser beam along a cut line of an integrated circuit package. The cut line defines a removable portion, the cutting occurs along the cut line, and the removable portion is removed after the directing. A method of troubleshooting an integrated circuit package is also disclosed.
    Type: Application
    Filed: October 18, 2019
    Publication date: April 22, 2021
    Inventors: Ali Hadjikhani, Michael R. Parent