Abstract: A cooling assembly for cooling a CPU on a motherboard in a low profile electronic device. The assembly comprises a channel-shaped heat sink having a flat first wall, an opposite wall, open first and second ends and internal heat exchange fins extending between those walls and ends. An electric blower having an inlet and an outlet is mounted to the heat sink so that the blower outlet is aligned with the first end of the heat sink and the heat sink is anchored to the CPU so that the first wall of the heat sink is flush against the CPU and the blower inlet overhangs an edge of the motherboard. Preferably, a baffle member is mounted to the heat sink to direct heated air from the second end of the heat sink to the atmosphere and to prevent recirculation of that air back to the blower inlet.