Patents by Inventor Michael R. Trahan

Michael R. Trahan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink interface having three-dimensional tolerance compensation
    Patent number: 8537552
    Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: September 17, 2013
    Assignee: Raytheon Company
    Inventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth, Michael P. Martinez, Michael R. Trahan
  • Heat Sink Interface Having Three-Dimensional Tolerance Compensation
    Publication number: 20110075377
    Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
    Type: Application
    Filed: September 25, 2009
    Publication date: March 31, 2011
    Applicant: Raytheon Copany
    Inventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth, Michael P. Martinez, Michael R. Trahan