Abstract: Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.

Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.

Abstract: A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.

Abstract: A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.

Abstract: In a machine for planarizing wafers, when a spindle carrier descends over the load station, it needs a way of determining whether it should descend to a first position suitable for depositing a wafer onto the load station or whether it should descend to a lower second position suitable for acquiring a wafer that is already present on the load station. The present invention provides a way of making this determination. The load station includes three upwardly-directed nozzles for use in supporting a wafer on three separate spaced cushions of purified water. The nozzles are supplied through branch conduits from a supply main. When no wafer is present, the pressurized water meets with little resistance as it is discharged from the nozzles. Accordingly, the pressure in the branches is relatively low. In contrast, when a wafer is present the wafer partially impedes the discharge of the water from the nozzles, causing the pressure in the branches to be greater than when no wafer is present.

Abstract: Exemplary methods, systems and apparatus are provided for accomplishing mixing of chemistries, such as those used in polishing materials used in semiconductor manufacturing. A manifold is provided that combines chemistries with a mixing element, for example, so that the stability of the chemical solution can be maintained so as to facilitate polishing. The mixing element can be oriented in a stationary position, or alternatively, it can be agitated.

Abstract: A nozzle that extends telescopically upward is used to elevate a wafer without contacting the wafer. The nozzle includes a stationary hollow cylinder, closed at its lower end and open at its upper end, within which a spool is disposed to slide vertically. In its lowest position the spool is spaced from the closed bottom of the cylinder, and purified water is supplied under pressure to the space. A passage extends vertically through the spool, and the water is discharged at the upper end of the spool from the passage. As a wafer is lowered toward the upper end of the spool, the wafer partially impedes the discharge, increasing the pressure in the space below the spool. The increased pressure drives the spool and the wafer upward, but the wafer never comes into contact with the wafer because the discharge of water creates a protective cushion between them.

Abstract: Exemplary methods, systems and apparatus are provided for accomplishing mixing of chemistries, such as those used in polishing materials used in semiconductor manufacturing. A manifold is provided that combines chemistries with a mixing element, for example, so that the stability of the chemical solution can be maintained so as to facilitate polishing. The mixing element can be oriented in a stationary position, or alternatively, it can be agitated.

Abstract: A load station is used in a planarizing machine to perform several useful functions related to handling of a wafer. By centering the wafer with respect to a spindle carrier the load station interrupts the accumulation of positional errors. The load station never makes solid contact with the wafer, but instead the wafer is continually levitated on three cushions of water that are directed upwardly against the lower face of the wafer. The presence of the wafer partially impedes the flow of water from the nozzles used for levitation causing an increase in the water pressure immediately upstream of the nozzles. This increased pressure is sensed and used as an indicator of the presence of a wafer at the load station. The load station further includes a nozzle that directs a stream against the lower side of the wafer so as to elevate the wafer from the load station into the carrier.

Abstract: In one type of planarizing machine, a wafer is maintained with its fragile processed side facing downward as the wafer is passed from a robot to a load station and from the load station to a spindle carrier, and then returned from the spindle carrier to the load station to the robot. These transfers must be accomplished without anything solid contacting the downwardly facing side of the wafer. This is accomplished by supporting the wafer, while it is on the load station, on cushions of purified water. The cushions are formed at three spaced areas on the lower side of the wafer by upwardly-directed nozzles located below the wafer. The purified water is discharged with sufficient force to prevent the wafer from contacting the nozzles. The use of three separate cushions insures stability of the wafer.

Abstract: In a machine for planarizing wafers, when a spindle carrier descends over the load station, it needs a way of determining whether it should descend to a first position suitable for depositing a wafer onto the load station or whether it should descend to a lower second position suitable for acquiring a wafer that is already present on the load station. The present invention provides a way of making this determination. The load station includes three upwardly-directed nozzles for use in supporting a wafer on three separate spaced cushions of purified water. The nozzles are supplied through branch conduits from a supply main. When no wafer is present, the pressurized water meets with little resistance as it is discharged from the nozzles. Accordingly, the pressure in the branches is relatively low. In contrast, when a wafer is present the wafer partially impedes the discharge of the water from the nozzles, causing the pressure in the branches to be greater than when no wafer is present.

Abstract: A load station is used in a planarizing machine to perform several useful functions related to handling of a wafer. By centering the wafer with respect to a spindle carrier the load station interrupts the accumulation of positional errors. The load station never makes solid contact with the wafer, but instead the wafer is continually levitated on three cushions of water that are directed upwardly against the lower face of the wafer. The presence of the wafer partially impedes the flow of water from the nozzles used for levitation causing an increase in the water pressure immediately upstream of the nozzles. This increased pressure is sensed and used as an indicator of the presence of a wafer at the load station. The load station further includes a nozzle that directs a stream against the lower side of the wafer so as to elevate the wafer from the load station into the carrier.

Abstract: A nozzle that extends telescopically upward is used to elevate a wafer without contacting the wafer. The nozzle includes a stationary hollow cylinder, closed at its lower end and open at its upper end, within which a spool is disposed to slide vertically. In its lowest position the spool is spaced from the closed bottom of the cylinder, and purified water is supplied under pressure to the space. A passage extends vertically through the spool, and the water is discharged at the upper end of the spool from the passage. As a wafer is lowered toward the upper end of the spool, the wafer partially impedes the discharge, increasing the pressure in the space below the spool. The increased pressure drives the spool and the wafer upward, but the wafer never comes into contact with the wafer because the discharge of water creates a protective cushion between them.