Patents by Inventor MICHAEL RAS

MICHAEL RAS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding using one-component epoxy adhesive mixtures
    Patent number: 11173672
    Abstract: Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: November 16, 2021
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
    Inventors: Andreas Lutz, Daniel Schneider, Irene Maeder, Marcel Aschwanden, Michael Ras
  • METHOD FOR BONDING USING ONE-COMPONENT EPOXY ADHESIVE MIXTURES
    Publication number: 20210237365
    Abstract: Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.
    Type: Application
    Filed: May 16, 2019
    Publication date: August 5, 2021
    Inventors: ANDREAS LUTZ, DANIEL SCHNEIDER, IRENE MAEDER, MARCEL ASCHWANDEN, MICHAEL RAS