Abstract: A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.

Abstract: The invention relates to an ink jet pen having exposed surfaces which are coated with a polymeric material. The polymeric material is treated with ultraviolet energy at a wavelength and for a period of time sufficient to increase the surface energy of the coating to thereby enhance the adhesive properties of the coating. The coated polymeric material and treated pen exhibits improved corrosion resistance and are more compatible with adhesives used to assemble components of the pen than similar untreated coatings.

Abstract: A printhead comprises a source of ink, a body, a mounting base, and an ink heater thermally coupled to the mounting base. A flowpath delivers ink from the ink source to the heater and is defined at least in part by the mounting base on the body. Three or more thermally conductive paths extend from the mounting base to the body. Preferably, one or more of the thermally conductive paths are heat conductive bridges extending from the mounting base to the body through an edge feed via.

Abstract: The invention described in the specification relates to an ink jet printhead structure having semiconductor substrate containing energy imparting devices for ejecting ink through nozzle holes in a nozzle plate, to a method for making a printhead structure and to a printer cartridge containing the printhead structure. In order to reduce stresses induced in the structure during manufacturing and/or use thereof, a polymeric layer is disposed between the semiconductor substrate and nozzle plate which contains expansion void spaces or valleys sufficient to inhibit stresses in the structure during a process for bonding the nozzle plate to the polymeric layer thereby reducing misalignment and warpage problems associated with conventional printhead structures.

Abstract: The invention described in the specification relates to an improved method for making a printhead for an ink jet printer. In the method, one or more semiconductor substrates containing energy imparting devices for ink and electrical conductors for the energy imparting devices are attached to a metal substrate carrier. A conductive layer containing electrical tracing terminating in contact pads is also attached to the carrier using an adhesive. A nozzle plate is attached to the conductive layer and to the semiconductor substrate also using an adhesive. The nozzle plate, conductive layer and adhesive all have openings or windows therein for use in forming wire bonds between the semiconductor substrate and the conductive layer. Once the wire bonds having loops are formed, the wire loops are depressed toward the nozzle plate to reduce the height of the loops above the nozzle plate. The entire wires and bonds are then encapsulated in a elastomeric, insulative material to protect the wires.

Abstract: An ink jet printhead includes a chip layer having a via for receiving ink, and having at least one actuator. A barrier layer is disposed adjacent the chip layer, and forms at least one throat which has a width and a cross-sectional area. The barrier layer also forms at least one bubble chamber, with each throat adapted to receive ink from the via and provide it to the respective bubble chamber. A nozzle layer is disposed adjacent the barrier layer, opposite the chip layer, and forms at least one nozzle for ejecting ink from the respective bubble chamber when the ink is energized by the associated actuator. At least one post is disposed proximate the throat, and extends part way between the chip layer and the nozzle layer. The post forms one or more gates through which the ink must pass from the via to the at least one throat.