Abstract: An apparatus for transferring heat from an electrical module includes: (a) a thermally conductive base member having a plurality of edges establishing a polygonal perimeter and having a first side for presentation toward the electrical module; and (b) a heat transferring structure integrally formed with the base member and extending from a second side of the base member opposite from the first side. The heat transferring structure occupies less than all of the second side and establishes a margin substantially about the perimeter.

Abstract: A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: a substantially rod-shaped positioning member having a length generally symmetrically oriented about an axis and a generally constant lateral expanse substantially perpendicular with said axis substantially along said length; said positioning member interferingly fitting within at least one of a first aperture in said substrate and a second aperture in said heat transferring device to maintain a predetermined separation between said substrate and said heat transferring device in said assembled orientation.

Abstract: The present invention provides magnetic structure, particularly an isolation transformer, which includes a shield to prevent radiation of electromagnetic interference (“EMI”). The magnetic structure includes a support structure, or bobbin, on which are mounted windings formed from electrical conductors. The windings are electrically connected to termination points, which provide the electrical interconnections for the magnetic structure. A magnetic core can be included in the support structure to provide optimal magnetic properties to the device. An EMI shield formed from a metallic foil such as copper is wrapped around the winding to prevent the radiation of EMI. The EMI shield is connected to a shield pin in the support structure by a conductive strap such that the shield pin is electrically connectable to a fixed potential through a safety rated capacitor to provide a low impedance path for currents induced in the EMI shield.

Abstract: A system for fixing two components together includes: (a) a boss integrally formed from one component about a boss axis; and (b) a latch integrally formed from the other component in a depending extension facilitating latch movement in an engaging plane and exerting a spring force urging the latch toward a first position. The latch is oriented about a latch axis in the engaging plane. The latch is in the first position when the components are situated in an initial position with the latch axis and the boss axis separated a first distance. The latch axis and the boss axis are separated a second distance less than the first distance when the components are urged together to an installed orientation with the latch held from the first position by the boss bearing against the latch with the engaging plane crossing the boss axis.

Abstract: A system for fixing two components together includes: (a) a boss integrally formed from one component about a boss axis; and (b) a latch integrally formed from the other component in a depending extension facilitating latch movement in an engaging plane and exerting a spring force urging the latch toward a first position. The latch is oriented about a latch axis in the engaging plane. The latch is in the first position when the components are situated in an initial position with the latch axis and the boss axis separated a first distance. The latch axis and the boss axis are separated a second distance less than the first distance when the components are urged together to an installed orientation with the latch held from the first position by the boss bearing against the latch with the engaging plane crossing the boss axis.

Abstract: An improved package for a semiconductor device. The semiconductor device includes an apparatus having at least two access leads to facilitate electrical connection of the apparatus within an electrical circuit. The package has generally a closed polyhedral shape presenting a plurality of faces and substantially insulatingly surrounding the apparatus in a manner leaving the access leads exposed for effecting electrical connection. The access leads extend a distance from exit loci from the package. The exit loci are situated on an exit face of the package, adjacent pairs of exit loci being generally in a common plane. An intraplanar distance within the common plane is established intermediate each adjacent pair of the exit loci. The improvement comprises configuring the exit face to establish an on-surface path greater than the intraplanar distance intermediate selected adjacent pairs of the exit loci.