Patents by Inventor Michael Real

Michael Real has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9373577
    Abstract: A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the substrate, and a first terminal on the first side of the substrate. The semiconductor package further includes copper or aluminum bonding wires or ribbons connecting the first terminal to an output of the RF semiconductor die, and gold bonding wires or ribbons connecting the capacitor to the output of the RF semiconductor die. The gold bonding wires or ribbons are designed to accommodate greater RF Joule heating during operation of the RF semiconductor die than the copper or aluminum bonding wires or ribbons. Corresponding methods of manufacturing are also described.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: June 21, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alexander Komposch, Brian William Condie, Erwin Orejola, Michael Real
  • Publication number: 20140346637
    Abstract: A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the substrate, and a first terminal on the first side of the substrate. The semiconductor package further includes copper or aluminum bonding wires or ribbons connecting the first terminal to an output of the RF semiconductor die, and gold bonding wires or ribbons connecting the capacitor to the output of the RF semiconductor die. The gold bonding wires or ribbons are designed to accommodate greater RF Joule heating during operation of the RF semiconductor die than the copper or aluminum bonding wires or ribbons. Corresponding methods of manufacturing are also described.
    Type: Application
    Filed: May 21, 2013
    Publication date: November 27, 2014
    Inventors: Alexander Komposch, Brian William Condie, Erwin Orejola, Michael Real
  • Publication number: 20040227039
    Abstract: A hardware leg for both bracing furniture joints and providing an integrated friction reducing foot pad for supporting the furniture item. The leg has an angled bracket portion mountable to individual panels or a pair of corner adjacent surfaces through screw or nail fastener holes, staple engageable nibs or through the penetratable plates of the bracket itself. The bracket and foot pad can be formed integrally through injection molding from a strong, durable, slick, non-scratching plastic material such as graphite impregnated acetal resin. Further, colored dyes can be selected and mixed with the material during molding to provide a leg color matched to the furniture piece.
    Type: Application
    Filed: May 13, 2003
    Publication date: November 18, 2004
    Inventors: Michael Real, Francisco Real, Alex Gonzalez
  • Publication number: 20030173312
    Abstract: A caddy for holding a stack of compact disk cases comprises a plurality of trays each shaped and dimensioned to hold a single compact disk case. Each tray is rotatably and slidingly connected to a pair of vertical jambs associated with a case, cabinet or other similar enclosure. The upper front edge of each tray is arcuately and concavely cut to allow viewing of the label-carrying side of the case. The front bottom part of the tray includes a window for viewing a section of the case bottom. Each tray can be flipped upwardly after having translated the entire stack of trays immediately above it along grooves in the supporting jambs.
    Type: Application
    Filed: March 12, 2002
    Publication date: September 18, 2003
    Inventors: Frank Real, Michael Real
  • Patent number: D485725
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: January 27, 2004
    Inventor: Michael Real