Abstract: An ATP non-competitive inhibitor of mitogen-activated protein kinase (MEK), inter alia, human MEK (MEK1 or MEK2) having the properties: (i) allosterically binds an inhibitor pocket formed at an interaction interface between human MEK (MEK1 or MEK2) and human Kinase Suppressor of Ras (KSR1 or KSR2 or BRAF) adjacent to ATP in a physiological complex between MEK and KSR (or BRAF), forming an inhibitor-inhibitor pocket complex; (ii) is an ATP non-competitive kinase inhibitor; (iii) a structure such that when bound to the inhibitor-inhibitor pocket complex, the complex comprises the structural elements: (a) at least one moiety of the inhibitor engaging A825 of KSR1, or P878 of KSR2; or R662 of BRAF (b) at least one moiety engaging R234 of MEK, wherein where R234 is within 5 ? from any atoms of KSR1 or KSR2 or BRAF is disclosed.

Abstract: A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the substrate, and a first terminal on the first side of the substrate. The semiconductor package further includes copper or aluminum bonding wires or ribbons connecting the first terminal to an output of the RF semiconductor die, and gold bonding wires or ribbons connecting the capacitor to the output of the RF semiconductor die. The gold bonding wires or ribbons are designed to accommodate greater RF Joule heating during operation of the RF semiconductor die than the copper or aluminum bonding wires or ribbons. Corresponding methods of manufacturing are also described.

Abstract: A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the substrate, and a first terminal on the first side of the substrate. The semiconductor package further includes copper or aluminum bonding wires or ribbons connecting the first terminal to an output of the RF semiconductor die, and gold bonding wires or ribbons connecting the capacitor to the output of the RF semiconductor die. The gold bonding wires or ribbons are designed to accommodate greater RF Joule heating during operation of the RF semiconductor die than the copper or aluminum bonding wires or ribbons. Corresponding methods of manufacturing are also described.

Abstract: A hardware leg for both bracing furniture joints and providing an integrated friction reducing foot pad for supporting the furniture item. The leg has an angled bracket portion mountable to individual panels or a pair of corner adjacent surfaces through screw or nail fastener holes, staple engageable nibs or through the penetratable plates of the bracket itself. The bracket and foot pad can be formed integrally through injection molding from a strong, durable, slick, non-scratching plastic material such as graphite impregnated acetal resin. Further, colored dyes can be selected and mixed with the material during molding to provide a leg color matched to the furniture piece.

Abstract: A caddy for holding a stack of compact disk cases comprises a plurality of trays each shaped and dimensioned to hold a single compact disk case. Each tray is rotatably and slidingly connected to a pair of vertical jambs associated with a case, cabinet or other similar enclosure. The upper front edge of each tray is arcuately and concavely cut to allow viewing of the label-carrying side of the case. The front bottom part of the tray includes a window for viewing a section of the case bottom. Each tray can be flipped upwardly after having translated the entire stack of trays immediately above it along grooves in the supporting jambs.