Abstract: Apparatuses and methods for high density laser optics are provided. An example, of a laser optics apparatus includes a plurality of vertical cavity surface emitting lasers (VCSELs) in a monolithically integrated array, a high contrast grating (HCG) integrated with an aperture of a vertical cavity of each of the plurality of the VCSELs to enable emission of a single lasing wavelength of a plurality of lasing wavelengths, and a plurality of single mode waveguides, each integrated with a grating coupler, that are connected to each of the plurality of the integrated VCSELs and the HCGs, where each of the grating couplers is aligned to an integrated VCSEL and HCG.

Abstract: Systems, methods, and apparatus to route optical signals are disclosed. An example apparatus to route optical signals includes a plurality of hollow metal waveguide optical switch arrays. Each of the arrays comprises a plurality of optical input ports and a plurality of optical output ports. The input ports and the output ports for a first one of the arrays are arranged in a first plane, the input ports and the output ports for a second one of the arrays are arranged in a second plane, and the plurality of arrays are stacked such that the first and second planes are adjacent. The first one of the arrays is to convey optical signals from a first communication device to a second communication device and the second one of the arrays is to convey optical signals from the second communication device to the first communication device.

Abstract: An apparatus includes a flexible circuit cable to transport an electrical signal. The apparatus includes a mechanically floating contact integrated into the flexible circuit cable to facilitate connection of the electrical signal between a circuit and the flexible circuit cable.

Abstract: An apparatus can comprise an optical slab comprising a rigid substrate of substantially transmissive material. The apparatus can also comprise a WDM multiplexer to receive and combine a plurality of optical signals at different wavelengths to form a combined optical signal in the optical slab having an aggregate power. The apparatus can further comprise a broadcaster to distribute the combined optical signal from the optical slab to each of a plurality of different optical receivers with a fraction of the aggregate power of the combined optical signal.

Abstract: A circuit switched optical device includes a first array of intersecting hollow waveguides formed in a first plane of a substrate. A second array of intersecting hollow waveguides is formed in a second plane of the substrate, and the second plane is positioned parallel to the first plane. An optical element within the first array selectively redirects an optical signal from the first array to the second array.

Abstract: Methods and apparatus for optical architectures are disclosed. An optical architecture includes first and second riser cards and first and second components carried by the first and second riser cards respectively. The optical architecture also includes a first matrix to fan-out a multi-bit optical input signal into first and second outbound signals, and first and second fiber optic cables to carry the first and second outbound signals to the first and second riser cards, respectively.

Abstract: A glass-silicon wafer stacked platform.

Abstract: An apparatus for use in optoelectronics includes a first alignment element and a first wafer comprising a through optical via. The first alignment element is bonded to the first wafer, such that the through optical via is uncovered by the first alignment element. In addition, the first wafer further comprises a plurality of bond pads upon which an optoelectronic component having an optical element is to be attached, in which the first alignment element is to mate with a mating alignment element on an optical transmission medium, and wherein the optical transmission medium is to be passively aligned with the optical element through the through optical via when the first alignment element is mated with the mating alignment element on the optical transmission medium.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: A circuit switched optical interconnection fabric includes a first hollow metal waveguide and a second hollow metal waveguide which intersects the first hollow metal waveguide to form an intersection. An optical element within the intersection is configured to selectively direct an optical signal between the first hollow metal waveguide and a second hollow metal waveguide.

Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

Abstract: A module includes a housing. The housing can include a port. The port can extend though an opening in the housing if the module is inserted in the chassis.

Abstract: An optical connector includes a connector plate having a connecting face operable to mate with a different connecting face on a different optical connector. A slot can be formed in a side of the connector plate and have a length (L) extending from the connecting face to an opposite face in a direction substantially perpendicular to the connecting face. A groove can be formed in a portion of the bottom wall of the slot and can extend at least partially along the length of the slot. The groove can receive an optical fiber. The optical connector can also include a retaining block shaped to fit between side walls of the slot and between the connecting face and the opposite face to retain the optical fiber within the groove.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: Systems and a method for routing optical signals are disclosed. One system includes a first large core hollow metal waveguide configured to guide a substantially coherent optical beam. A second large core hollow waveguide is optically coupled to the first waveguide with a coupling device. The coupling device is configured to divide the coherent optical beam into a transmitted beam and a reflected beam. Beam walk-off within the coupling device causes the transmitted beam to be shifted by an offset amount. The second large core hollow metal waveguide is shifted from the first large core hollow metal waveguide by approximately the offset amount to receive the shifted transmitted beam.

Abstract: An optical power splitter includes a zig-zag and a reflector element associated with the zig-zag. The zig-zag is to split an input signal based on the reflector element, and output a plurality of split signals.

Abstract: A modulatable source is to generate a signal. A multi-mode fiber is to propagate the signal. The fiber is associated with a fiber d*NA, corresponding to a product of a fiber diameter (d) and a fiber numerical aperture (NA), substantially between 1 micron radian and 4 micron radian. A receiver is to receive the propagated signal.

Abstract: Waveguide array optical power splitters that provide compact, low-cost implementation of optical power splitting for one and two dimensional optical waveguide arrays are disclosed. The optical power splitters do not introduce mode dependent loss and preserve polarization, enabling the optical power splitters to be used with multimode and single mode light sources. In one aspect, an optical power splitter includes a beamsplitter to receive a plurality of incident beams of light. The beamsplitter splits each incident beam of light into a plurality of output beams of light with each output beam output in a different direction from the beamsplitter. The optical power splitter includes a first set of lenses with each lens to approximately collimate one of the incident beams of light, and includes a second set of lenses with each lens to focus the output beams of light.

Abstract: Vertical-cavity surface-emitting lasers (“VCSELs”) and VCSEL arrays are disclosed. In one aspect, a surface-emitting laser includes a grating layer having a sub-wavelength grating to form a resonant cavity with a reflective layer for a wavelength of light to be emitted from a light-emitting layer and an aperture layer disposed within the resonant cavity. The VCSEL includes a charge carrier transport layer disposed between the grating layer and the light-emitting layer. The transport layer has a gap adjacent to the sub-wavelength grating and a spacer region between the gap and the light-emitting layer. The spacer region and gap are dimensioned to be substantially transparent to the wavelength. The aperture layer directs charge carriers to enter a region of the light-emitting layer adjacent to an aperture in the aperture layer and the aperture confines optical modes to be emitted from the light-emitting layer.

Abstract: A mechanically aligned optical engine includes an optoelectronic component connected to a first side of a bench substrate and a transparent substrate bonded to a second side of the bench substrate. The transparent substrate comprises a mechanical feature designed to fit within an aperture of the bench substrate such that a lens formed onto the transparent substrate is aligned with an active region of the optoelectronic component.