Patents by Inventor Michael Reyer

Michael Reyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Determining distance correction values for laser machining a workpiece
    Patent number: 10814422
    Abstract: Methods, machines, and computer-readable mediums for determining distance correction values of a desired distance between a laser processing nozzle on a laser processing head and a workpiece during laser processing of the workpiece are provided. In some implementations, the workpiece is scanned along a desired path of a surface of the workpiece separately by the laser processing nozzle and a measurement head arranged in place of the laser processing nozzle on the laser processing head, with a capacitively measured distance identical to the desired distance. The measurement head has a lower lateral sensitivity of a capacitance measurement than the laser processing nozzle. Respective scanned movement paths of the laser processing nozzle and the measurement head are determined. The distance correction values for the desired distance of the laser processing nozzle are then determined from the scanned movement paths determined with the laser processing nozzle and the measurement head.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: October 27, 2020
    Assignee: TRUMPF Laser-und Systemtechnik GmbH
    Inventors: Tobias Hagenlocher, Thomas Kieweler, Michael Reyer, Wolf Wadehn
  • Determining Distance Correction Values for Laser Machining a Workpiece
    Publication number: 20170151629
    Abstract: Methods, machines, and computer-readable mediums for determining distance correction values of a desired distance between a laser processing nozzle on a laser processing head and a workpiece during laser processing of the workpiece are provided. In some implementations, the workpiece is scanned along a desired path of a surface of the workpiece separately by the laser processing nozzle and a measurement head arranged in place of the laser processing nozzle on the laser processing head, with a capacitively measured distance identical to the desired distance. The measurement head has a lower lateral sensitivity of a capacitance measurement than the laser processing nozzle. Respective scanned movement paths of the laser processing nozzle and the measurement head are determined. The distance correction values for the desired distance of the laser processing nozzle are then determined from the scanned movement paths determined with the laser processing nozzle and the measurement head.
    Type: Application
    Filed: February 13, 2017
    Publication date: June 1, 2017
    Inventors: Tobias Hagenlocher, Thomas Kieweler, Michael Reyer, Wolf Wadehn