Abstract: The invention relates to non-systemic TGR5 agonist useful in the treatment of chemotherapy-induced diarrhea, diabetes, Type II diabetes, gestational diabetes, impaired fasting glucose, impaired glucose tolerance, insulin resistance, hyperglycemia, obesity, metabolic syndrome, ulcerative colitis, Crohn's disease, disorders associated with parenteral nutrition especially during short bowel syndrome, and irritable bowel syndrome (IBS), and other TGR5 associated diseases and disorders, having the Formula: where R1, R2, R2?, R3, R4, X1, X2, X3, X4, Q, and n are described herein.

Abstract: This disclosure provides systems for generating customized datasets. An example dataset generator mines contacts from multiple members of an enterprise, applies a pattern recognition process to determine attributes of the contacts aligned with objectives of the enterprise, stores the contacts and associated attributes in a relational data structure, and through a machine learning process, generates a customized contact dataset of the contacts with attributes relevant to a user request, an event, or a notification received. The example dataset generator may also generate an action steps dataset for the user. The dataset generator may aggregate contacts from calls, chats, emails, SMS messages, and video feeds of an enterprise, apply a pattern recognition process to determine attributes of the contacts, and through a machine learning process, partition and distribute the contacts and associated action steps on respective dashboards of multiple customer service representatives of the enterprise.

Abstract: Systems and methods for storing and querying voluminous “big data” are described, with application to append-only hyperscale databases. The methods dispense with blob abstractions such as objects and file systems, instead storing data as addressable binary sequences at all stages of storage and querying. In particular, a microservices architecture system arrangement combines with a powerful data format to create an architecture for executing an external query using a distributed process.

Abstract: Systems and methods for storing and querying voluminous “big data” are described, with application to append-only hyperscale databases. The methods dispense with blob abstractions such as objects and file systems, instead storing data as addressable binary sequences at all stages of storage and querying. In particular, a microservices architecture system arrangement combines with a powerful data format to create an architecture for executing an external query using a distributed process.

Abstract: Systems and methods for storing and querying voluminous “big data” are described, with application to append-only hyperscale databases. The methods dispense with blob abstractions such as objects and file systems, instead storing data as addressable binary sequences at all stages of storage and querying. In particular, a microservices architecture system arrangement combines with a powerful data format to create an architecture for executing an external query using a distributed process.

Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.

Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.

Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.

Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.