Abstract: A composite material having inherent microbicidal activity is herewith described. The microbicidal composite material comprises of a first layer having a first predefined thickness and a first predefined stitch/thread density; a second layer having a second predefined thickness and a second predefined stitch/thread density; an intermediate layer having a third predefined thickness and a third predefined stitch/thread density, wherein the intermediate layer is sandwiched between the first layer and the second layer, and where the intermediate layer is connected to the first layer and the second layer to form a three dimensional structure, and where each layer in the three dimensional structure has a plurality of apertures. Further, at least one layer in the three dimensional structure comprises at least one of microfibers and nanofibers having augmented surface moieties, wherein the augmented surface moieties allow for binding of a microbicidal agent to impart the inherent microbicidal activity.

Abstract: A composite material having inherent microbicidal activity is herewith described. The microbicidal composite material comprises of a first layer having a first predefined thickness and a first predefined stitch/thread density; a second layer having a second predefined thickness and a second predefined stitch/thread density; an intermediate layer having a third predefined thickness and a third predefined stitch/thread density, wherein the intermediate layer is sandwiched between the first layer and the second layer, and where the intermediate layer is connected to the first layer and the second layer to form a three dimensional structure, and where each layer in the three dimensional structure has a plurality of apertures. Further, at least one layer in the three dimensional structure comprises at least one of microfibers and nanofibres having augmented surface moieties, wherein the augmented surface moieties allow for binding of a microbicidal agent to impart the inherent microbicidal activity.

Abstract: An apparatus for transporting, storing and airing equipment is provided having a container and a support structure. The container is defined by a plurality sides of least one of which is movable to provide access to all of or a portion of an interior of the container. Equipment can be releasably attached to the interior via an organized array of attachments disposed along an interior surface of one or more side. The support structure can elevate a side of the container thereby disposing the container at an angle relative to a support floor. In that position, the container can be maintained in an open configuration allowing an air flow to pass over and/or through the equipment for airing.

Abstract: A hanger for merchandise to be displayed on a stand. The hanger includes a vertical back plate and hooks which can be placed on a stand made of horizontal rods. Merchandise holders extend forwardly from the back plate and receive merchandise thereon. The merchandise can be placed on the hanger at the manufacturing end, so that the store owner can easily fill a display stand by placing only a few hangers on the stand.

Abstract: A hanger for merchandise to be displayed on a stand. The hanger includes a vertical back plate and hooks which can be placed on a stand made of horizontal rods. Merchandise holders extend forwardly from the back plate and receive merchandise thereon. The merchandise can be placed on the hanger at the manufacturing end, so that the store owner can easily fill a display stand by placing only a few hangers on the stand.

Abstract: A method and process for reducing the amount of photoresist material required to uniformly coat a semiconductor wafer. A semiconductor wafer, having a top and a bottom surface, is placed onto a vacuum chuck of a photoresist coater system for applying photoresist to semiconductor wafers such that the semiconductor wafer is oriented in horizontal plane with the top surface of the semiconductor facing upwards. The vacuum chuck of the wafer coating system is rotated about a central axis thereof such that the semiconductor wafer achieves a first rotational speed. Next, the semiconductor wafer is decelerated from the first rotational speed to a second rotational speed while a minimal amount of photoresist material is concurrently dispensed onto the top surface of the semiconductor wafer. As the wafer reaches the second rotational speed, the dispensing of the photoresist material onto the top surface of the semiconductor wafer is stopped.