Abstract: Configuring a fault-sensing ring oscillator circuit is disclosed. In a particular embodiment, a fault-sensing ring oscillator circuit includes a plurality of ring oscillators; an enable circuit configured to enable and disable the plurality of ring oscillators; an OR circuit including a plurality of inputs, wherein each input is coupled to a respective ring oscillator of the plurality of ring oscillators; and a first fault detection latch including a SET input coupled to a first output of the OR circuit and a RESET input coupled to the enable circuit, wherein the first fault detection latch indicates a stuck at fault condition when the plurality of ring oscillators are disabled by the enable circuit and at least one of the plurality of ring oscillators is active.

Abstract: Embodiments include exerciser device placement in the development of an integrated circuit. Aspects of the invention include obtaining a design of an integrated circuit and creating a dynamic power blockage map for the integrated circuit. Aspects also include updating the integrated circuit design by placing one or more exercisers on the integrated circuit, wherein a location of the one or more exercisers on the integrated circuit is based on at least in part on the dynamic power blockage map. Based on a determination that the updated integrated circuit design complies with one or more design constraints, aspects further include outputting the updated integrated circuit design.

Abstract: A method can include obtaining characteristic data for a wafer. The characteristic data can correspond to the wafer in a processed state and can include a set of stress values of the wafer. The wafer can include a front side, a back side opposite the front side, and a set of regions. The set of stress values can include a first stress value corresponding to a first region. In the processed state, one or more front-side processes can be completed on the front side of the wafer. The method can include determining that the first stress value exceeds a stress threshold and generating a compensation map. The compensation map can identify one or more regions for forming one or more trenches. The method can include initiating, based on the compensation map, a formation of a first trench on the back side of the wafer in the first region.

Abstract: The method and systems described herein provide for identifying and mitigating undesirable power or voltage fluctuations in regions of a semiconductor device. For example, embodiments include detecting a region, such as an individual processor, of a processor chip is exhibiting a reduced power draw and a resulting localized voltage spike (e.g., a spike that exceeds Vmax) that would accelerate overall device end-of-life (EOL). The described systems respond by activating circuits or current generators located in the given region to draw additional power via a protective current. The protective current lowers the local voltages spikes back to within some pre-specified range (e.g., below a Vmax). The resulting reduction in the time above Vmax in testing reduces the number of devices that will need to be discarded due to Vmax violations as well as increases the expected reliability and lifespan of the device in operation.

Abstract: The method and systems described herein provide for identifying and mitigating undesirable power or voltage fluctuations in regions of a semiconductor device. For example, embodiments include detecting a region, such as an individual processor, of a processor chip is exhibiting a reduced power draw and a resulting localized voltage spike (e.g., a spike that exceeds Vmax) that would accelerate overall device end-of-life (EOL). The described systems respond by activating circuits or current generators located in the given region to draw additional power via a protective current. The protective current lowers the local voltages spikes back to within some pre-specified range (e.g., below a Vmax). The resulting reduction in the time above Vmax in testing reduces the number of devices that will need to be discarded due to Vmax violations as well as increases the expected reliability and lifespan of the device in operation.

Abstract: A method can include obtaining characteristic data for a wafer. The characteristic data can correspond to the wafer in a processed state and can include a set of stress values of the wafer. The wafer can include a front side, a back side opposite the front side, and a set of regions. The set of stress values can include a first stress value corresponding to a first region. In the processed state, one or more front-side processes can be completed on the front side of the wafer. The method can include determining that the first stress value exceeds a stress threshold and generating a compensation map. The compensation map can identify one or more regions for forming one or more trenches. The method can include initiating, based on the compensation map, a formation of a first trench on the back side of the wafer in the first region.

Abstract: Aspects of the invention include a method that includes performing timing analysis of an integrated circuit design to identify a critical path. The critical path fails to meet a corresponding timing requirement. The method also includes determining an amount of slack needed by the critical path. The amount of slack is an amount by which the critical path fails to meet the corresponding timing requirement. Downstream slack is created in each path of a next cycle, wherein each path of the next cycle is immediately downstream of the critical path. Slack stealing is performed to improve timing of the critical path based on the downstream slack created in each path of the next cycle.

Abstract: Methods and systems for handling a single event upset. The methods include, and/or the systems include functionality for, receiving, from a monitored device, data at a first input of an initial state change device; detecting, based on receiving the data, a state change; asserting, based on detecting the state change, an initial state change device enable signal; transferring the first data from the first input to a first output of the initial state change device (which may be operatively connected to a second input of a state hold device); triggering, based on detecting the state change, a delay counter; making a determination that the delay period counted by the delay counter expired without receipt of an error detection signal; and based on the determination, asserting a state hold device enable signal to allow the data to pass from the second input to a second output of the state hold device.

Abstract: Methods and systems for handling a single event upset. The methods include, and/or the systems include functionality for, receiving, from a monitored device, data at a first input of an initial state change device; detecting, based on receiving the data, a state change; asserting, based on detecting the state change, an initial state change device enable signal; transferring the first data from the first input to a first output of the initial state change device (which may be operatively connected to a second input of a state hold device); triggering, based on detecting the state change, a delay counter; making a determination that the delay period counted by the delay counter expired without receipt of an error detection signal; and based on the determination, asserting a state hold device enable signal to allow the data to pass from the second input to a second output of the state hold device.

Abstract: Methods and systems for handling a single event upset. The methods include, and/or the systems include functionality for, receiving, from a monitored device, data at a first input of an initial state change device; detecting, based on receiving the data, a state change; asserting, based on detecting the state change, an initial state change device enable signal; transferring the first data from the first input to a first output of the initial state change device (which may be operatively connected to a second input of a state hold device); triggering, based on detecting the state change, a delay counter; making a determination that the delay period counted by the delay counter expired without receipt of an error detection signal; and based on the determination, asserting a state hold device enable signal to allow the data to pass from the second input to a second output of the state hold device.

Abstract: Methods and systems for handling a single event upset. The methods include, and/or the systems include functionality for, receiving, from a monitored device, data at a first input of an initial state change device; detecting, based on receiving the data, a state change; asserting, based on detecting the state change, an initial state change device enable signal; transferring the first data from the first input to a first output of the initial state change device (which may be operatively connected to a second input of a state hold device); triggering, based on detecting the state change, a delay counter; making a determination that the delay period counted by the delay counter expired without receipt of an error detection signal; and based on the determination, asserting a state hold device enable signal to allow the data to pass from the second input to a second output of the state hold device.