Abstract: Techniques for poster-thumbnail and/or animated thumbnail development and/or usage to effectively navigate for potential selection between a plurality of images or programs/video files or video segments. The poster and animated thumbnail images are presented in a GUI on adapted apparatus to provide an efficient system for navigating, browsing and/or selecting images or programs or video segments to be viewed by a user. The poster and animated thumbnails may be automatically produced without human-necessary editing and may also have one or more various associated data (such as text overlay, image overlay, cropping, text or image deletion or replacement, and/or associated audio).

Abstract: Techniques are provided enabling users to search for, select and/or watch an infomercial of interest including commercials, advertisements, and the like from a recorded stream. The user's history can be analyzed in the DVR, and replacing an original advertisement in a live/recorded program by one or more other advertisement(s) belonging to a genre type from the user history stored in the DVR. A GUI is provided for an infomercial guide; and when a user selects the infomercial guide, displaying the infomercial guide so that the user can select infomercials of interest. The user may select the infomercial guide by pressing a dedicated key on a remote control. In a first window of the GUI, upper categories of infomercials that are recorded or downloaded in the DVR may be displayed. The user may select one of the upper categories of interest by moving a highlight cursor.

Abstract: An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate, and is provided with electrical connections to the package leads. A rigid upper protective layer is provided to substantially enclose the integrated circuit die, and at least partially cover the top surface of the upper insulative layer. The integrated circuit device package further comprises a rigid or semi-rigid lower protective layer opposite the upper protective layer. The rigid lower protective layer is prefomed, and preferably is made from a material selected from the group consisting of rigid ceramic, glass, plastic, and combinations thereof.