Abstract: The invention comprises a method and/or an apparatus for operating a Cannabis facility generating a tetrahydrocannabinol (THC) containing product, comprising the step of labeling the THC containing product with a matrix bar code/quick response (QR) code, the cannabis containing product comprising at least two milligrams of a tetrahydrocannabinol substance, the QR code linking to product information associated with the THC containing product, the product information comprising at least one of a location, date of harvest, strain, and/or type of a plant containing a tetrahydrocannabinol substance in the THC containing product; an extraction method; a date and/or a location of manufacture of the THC product; a related laboratory report; and/or a link to a related web page.

Abstract: The invention comprises a method and apparatus for forming a Cannabis product, comprising the steps of: combining tetrahydrocannabinol and ethanol to form a THC-alcohol compound, the THC-alcohol compound comprising less than fifty percent water by mass and subjecting the THC-alcohol compound to a shear force in excess of 100 or 50,000 sec?1. Optionally and preferably, formation of the Cannabis product results after successive steps of reducing viscosity of the tetrahydrocannabinol compound, such as by 2000+ cP and 20+ cP, or after reversing a first viscosity reducing step of 2000+ cP with a subsequent viscosity increase of 2000+ cP, such as in the formation of a THC containing drink, edible, vape pen solution, or preroll.

Abstract: The invention comprises a method and apparatus for forming a Cannabis product, comprising the steps of: preparing a tetrahydrocannabinol emulsion comprising particles, the particles comprising: (1) a first peak concentration of the particles, as a function of particle size, less than nine hundred nanometers in diameter; and (2) a second peak concentration of the particles greater than nine hundred nanometers in diameter and adding the tetrahydrocannabinol emulsion to at least one of: an edible, a beverage, an additive for use in a vape cartridge, and a pre-roll, where a mixer is used to form the particles containing tetrahydrocannabinol and where the particles comprise at least one of: a micelle comprising the tetrahydrocannabinol; a droplet of the tetrahydrocannabinol; a lipid bilayer cell comprising the tetrahydrocannabinol; a mixed droplet of both the tetrahydrocannabinol and an oil; and the tetrahydrocannabinol and at least one-tenth of a percent ethanol.

Abstract: The invention comprises a method and apparatus for amending a food product, comprising the steps of: (1) receiving into a second geographic zone the food product from a first geographic zone, where packaging greater than five milligrams per serving of tetrahydrocannabinol (THC) in the food product is illegal in the first geographic zone and legal in the second geographic zone; (2) forming a composition of the tetrahydrocannabinol comprising a viscosity of less than 2,000 mPa sec; and (3) injecting the food product with the composition of the tetrahydrocannabinol to form an amended food product, where the composition preferably comprises an emulsion of tetrahydrocannabinol, an emulsifier, and water with a mean particle size of less than 1000 nm and a viscosity of less than 100 mPa sec.

Abstract: The invention comprises an apparatus and a method for amending a food product, comprising the steps of: (1) receiving into a second geographic zone the food product from a first geographic zone, where packaging greater than five milligrams per serving of tetrahydrocannabinol in the food product is: (a) illegal in the first geographic zone and (b) legal in the second geographic zone; (2) forming a composition of the tetrahydrocannabinol comprising a viscosity of less than 2,000 mPa·sec; (3) injecting the food product with the composition of tetrahydrocannabinol to form an amended food product; and optionally (4) forming an emulsion of the tetrahydrocannabinol, an emulsifier, and water, the emulsion comprising, excluding particle sizes of less than 20 nm, a mean particle size of less than 1000 nm and a viscosity of less than 100 mPa·sec.

Abstract: The invention comprises a method and apparatus for holding a Cannabis product, such as a beverage container having a resealable closure that remains affixed to the beverage container when in both an open position and a closed position, where a cavity within the container comprises at least two servings of tetrahydrocannabinol (THC). The resealable closure optionally includes a slideable/rotatable element that is slideable/rotatable along a horizontal plane relative to an upper surface of the beverage container, the slideable/rotatable closure element alternatingly closing an opening in the lid when in a first position and allowing access through the opening when in a second position. The resealable container in combination with graphical THC serving size indicators allows a consumer to consume a known amount of THC.

Abstract: The invention comprises a method and apparatus for holding a Cannabis product, such as a THC containing beverage, comprising the steps of: preparing a concentrated emulsion of tetrahydrocannabinol with a concentration exceeding two thousand milligrams per twelve ounces; diluting the concentrated emulsion in a bright tank to yield a diluted emulsion comprising: (1) a tetrahydrocannabinol concentration of less than two hundred milligrams per twelve ounces and (2) a solution with a viscosity of less than twenty millipascal-seconds; and then pumping the diluted emulsion from the bright tank to a cavity of a beverage container, such as where the diluted emulsion comprises a mean micelle diameter greater than 600 nm.

Abstract: A separator for at least one of electrochemical energy accumulators or converters includes: a porous substrate with a comb polymer, the comb polymer containing a polymer main chain along several lateral chains that are covalently bonded to the polymer main chain. At least one of the lateral chains has at least one Lewis-acid or Lewis-base functionality.

Abstract: A membrane for selective transport of substances includes: a porous substrate with a comb polymer. The comb polymer contains a polymer main chain and several lateral chains covalently bonded to the polymer main chain. At least one of the several lateral chains has at least one Lewis-acid and/or Lewis-base functionality.

Abstract: Memory devices and systems with adjustable through-silicon via (TSV) delay, and associated methods, are disclosed herein. In one embodiment, an apparatus includes a plurality of memory dies and a TSV configured to transmit signals to or receive signals from the plurality of memory dies. The apparatus further includes circuitry coupled to the TSV and configured to introduce propagation delay onto signals transmitted to or received from the TSV. In some embodiments, the apparatus includes additional circuitry configured to activate, deactivate, adjust at least a portion of the circuitry, or any combination thereof, to alter the propagation delay. In this manner, the apparatus can align internal timings of memory dies of the plurality of memory dies.

Abstract: A thermoplastic molding composition is disclosed. The thermoplastic molding composition includes A) from 20 to 96.9% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of an inorganic phosphinate salt, C) from 1 to 15% by weight of an organic phosphinate salt, D) from 1 to 15% by weight of melamine cyanurate, E) from 0.1 to 10% by weight of a polyvinylpyrrolidone homopolymer, and F) from 0 to 50% by weight of other additives. The total of the percentages by weight of A) to F) is 100%.

Abstract: Described herein are thermoplastic molding materials including components: A) 10 to 98.5 wt % of a thermoplastic polyamide, B) 1 to 20 wt % of red phosphorus, C) 0.5 to 15 wt % of an aluminum salt of phosphonic acid, D) 0 to 55 wt % of a fibrous or particulate filler or mixtures thereof, E) 0 to 30 wt % of further additives, wherein the weight percentages of the components A) to E) sum to 100%.

Abstract: Memory devices and systems with adjustable through-silicon via (TSV) delay, and associated methods, are disclosed herein. In one embodiment, an apparatus includes a plurality of memory dies and a TSV configured to transmit signals to or receive signals from the plurality of memory dies. The apparatus further includes circuitry coupled to the TSV and configured to introduce propagation delay onto signals transmitted to or received from the TSV. In some embodiments, the apparatus includes additional circuitry configured to activate, deactivate, adjust at least a portion of the circuitry, or any combination thereof, to alter the propagation delay. In this manner, the apparatus can align internal timings of memory dies of the plurality of memory dies.

Abstract: A laser diode chip is described, comprising: an n-type semiconductor region (3), a p-type semiconductor region (5), and an active layer (4) arranged between the n-type semiconductor region (3) and the p-type semiconductor region (5), an n-type contact (9) and a p-type contact (8), at least one heating element (14) arranged on a side of the laser diode chip facing the p-type semiconductor region (5), the heating element (14) functioning as a resistance heater, and at least one metallic seed layer (7, 11), wherein the heating element comprises a part (11) of the seed layer, and wherein the p-type contact (8) is arranged on a further part (7) of the seed layer (7, 11).

Abstract: A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven.

Abstract: Disclosed is a polyamide composition including 30% to 99.9% by weight of a polyamide mixture as component A). Component A) includes aliphatic polyamide A1) and aliphatic copolyamide or terpolyamide A2). The weight ratio of A1) to A2) is 55:45 to 95:5. The polyamide composition also includes 0% to 60% by weight of glass fibers as component B), 0% to 2% by weight of nigrosin as component C), 0.1% to 10% by weight of at least one polyhydric alcohol including more than two hydroxyl groups and a number-average molecular weight (Mn) of less than 2000 as component D), 0% to 20% by weight of further additives as component E). The reported amounts sum to 100% by weight based on the total composition.

Abstract: Memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies. Each memory die of the plurality includes a command/address decoder. The command/address decoders are configured to receive command and address signals from external contacts of the memory device. The command/address decoders are also configured, when enabled, to decode the command and address signals and transmit the decoded command and address signals to every other memory die of the plurality. Each memory die further includes circuitry configured to enable, or disable, or both individual command/address decoders of the plurality of memory dies. In some embodiments, the circuitry can enable a command/address decoder of a memory die of the plurality after the plurality of memory dies are packaged into a memory device.

Abstract: Memory devices and systems with TSV health monitor circuitry, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies, a plurality of through-silicon vias (TSVs) in electrical communication with the memory dies; and circuitry. In some embodiments, the circuitry is configured to electrically couple a pair of TSVs of the plurality of TSVs to form a passive circuit. For example, the circuitry can activate a transistor electrically positioned between TSVs of the pair of TSVs to electrically couple the pair of TSVs. In these and other embodiments, the circuitry applies a test voltage to the pair of TSVs using the passive circuit to determine whether a TSV of the pair of TSVs includes degradation.

Abstract: Memory devices and systems with adjustable through-silicon via (TSV) delay, and associated methods, are disclosed herein. In one embodiment, an apparatus includes a plurality of memory dies and a TSV configured to transmit signals to or receive signals from the plurality of memory dies. The apparatus further includes circuitry coupled to the TSV and configured to introduce propagation delay onto signals transmitted to or received from the TSV. In some embodiments, the apparatus includes additional circuitry configured to activate, deactivate, adjust at least a portion of the circuitry, or any combination thereof, to alter the propagation delay. In this manner, the apparatus can align internal timings of memory dies of the plurality of memory dies.