Abstract: Disclosed herein is an applicator head and associated system and method for applying a coating to an object. The applicator head includes an elongated body with an external surface and an internal cavity. A coating inlet is formed in an upper portion of the elongated body and fluidically coupled with the internal cavity to enable a coating material to flow into the internal cavity from the coating inlet. A plurality of outlet ports are positioned along a lower portion of the elongated body and fluidically coupled with the internal cavity to enable the coating material to be dispensed from the internal cavity. A plurality of external ribs are disposed along the external surface of the elongated body and extend at a rib height from the external surface, at least one outlet port of the plurality of outlet ports is positioned between adjacent ones of the external ribs.

Abstract: Embodiments of the invention include a deposition machine that allows for continuous deposition of an object or substrate with a coating having a graded composition. The deposition machine includes a deposition chamber separated into a plurality of chamber areas by a baffle having an opening. The opening allows for migration of deposition material from one chamber area to another, allowing for a graded composition coating to be deposited on the object or substrate. Other embodiments include a system for forming an electronic device and a system and method for forming a graded composition on an object.

Abstract: The mixed signal chip (10) takes analogue signals received at, for example, a mobile telephone and converts them to the digital domain for subsequent processing. Through use of sample rate adaption and adjustable filtering, the mixed signal chip can work on radio signals formatted according to different standards.

Abstract: A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the flexible wrap-around interconnect is disposed around an outer surface of the substrate piece.