Patents by Inventor Michael Ryan Ng

Michael Ryan Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing solder wicking on a substrate
    Patent number: 9089063
    Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: July 21, 2015
    Assignees: Flextronics AP, LLC, Cisco Technology, Inc.
    Inventors: Glen C. Shepherd, Anthony Aaron Lynn Burton, Michael Ryan Ng, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran
  • Method of reducing solder wicking on a substrate
    Patent number: 8378222
    Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: February 19, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Glen C. Shepherd, Anthony Aaron Lynn Burton, Michael Ryan Ng, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran
  • Method of reducing solder wicking on a substrate
    Publication number: 20100094607
    Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.
    Type: Application
    Filed: December 11, 2009
    Publication date: April 15, 2010
    Inventors: Glen C. Shepherd, Anthony Aaron Lynn Burton, Michael Ryan Ng, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran
  • Substrate with via and pad structures
    Patent number: 7645940
    Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: January 12, 2010
    Assignees: Solectron Corporation, Cisco Technology, Inc.
    Inventors: Glen C. Shepherd, Anthony Aaron Lynn Burton, Michael Ryan Ng, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran