Abstract: An apparatus is provided for receiving and aligning a multiple electrode pair array and a multiple well plate used in electroporation. The apparatus includes a housing which includes a bottom housing portion and a pair of side housing portions which project upward from the bottom housing portion. A pair of board-reception structures are adjacent to the inner portions of the side housing portions. Multiple well plate engaging and disengaging means, supported by the housing, are provided for engaging a multiple well plate with a multiple electrode pair array and for disengaging a multiple well plate from a multiple electrode pair array. Preferably, the multiple well plate engaging and disengaging means include a multiple well plate lifting and lowering assembly. The multiple well plate lifting and lowering assembly can include lifting/lowering handles located outside the housing.

Abstract: Stacked LAN connector (10) adapted for mounting to a circuit board (24) and including a stacked USB component (150) and a modular jack component (200) secured in respective portions of main housing (50), around which is an outer shield (32). An inner shield (130) shields the arrays of contacts of the modular jack component (200) and the stacked USB component (150) as they depend from the board mounting face to be connected to circuits of the circuit board (24). LEDs (28,30) indicate full mating by a modular plug with the modular jack component. The connector saves board real estate otherwise occupied by a modular jack positioned beside a stacked USB connector on the circuit board.