Abstract: Spherical amorphous, non-porous silicas are useful for oral compositions. A method of making the spherical amorphous, non-porous silicas is also provided.

Abstract: A chemical mechanical polishing process including a single copper removal CMP slurry formulation for planarization of a microelectronic device structure preferably having copper deposited thereon. The process includes the bulk removal of a copper layer using a first CMP slurry formulation having oxidizing agent, passivating agent, abrasive and solvent, and the soft polishing and over-polishing of the microelectronic device structure using a formulation including the first CMP slurry formulation and at least one additional additive. The CMP process described herein provides a high copper removal rate, a comparatively low barrier material removal rate, appropriate material selectivity ranges to minimize copper dishing at the onset of barrier material exposure, and good planarization efficiency.

Abstract: A method of passivating a CMP composition by dilution and determining the relationship between the extent of dilution and the static etch rate of copper. Such relationship may be used to control the CMP composition during the CMP polish to minimize the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions in the CMP composition and at the copper/CMP composition interface.

Abstract: Aerogel particles having a mean particle size less than 1 micron, products containing the same, processes of making the same, and uses thereof are described. A process of making the particle is also described wherein starting aerogel particles are homogenized or wet milled. The starting aerogel particles can be surface treated during the milling process to prevent agglomeration or aggregation. The aerogel particles can be used in a variety of products and applications.

Abstract: The composites disclosed herein comprise silica and an antimicrobial metal oxide. The composites are useful in inhibiting microbial growth and are therefore useful in a variety of applications, including, for example, as components in dentifrice compositions.

Abstract: Novel mouth rinse (i.e., mouthwash) compositions that permit delivery of silica or silicate materials to the surface of teeth through common mouth rinsing procedures are provided. Such compositions must exhibit proper suspension of the silica or silicate materials (in particulate form) to prevent settling during storage while simultaneously providing proper mouth rinsing properties. Such silica or silicate materials may themselves exhibit any number of therapeutic or aesthetic benefits as long as such materials are easily transferred through mouth rinsing and exhibit proper affinity for deposit on target teeth upon contact therewith. Such silica or silicate materials should exhibit, in one embodiment, certain ionic charge levels as well as sufficiently small particle sizes to permit effective static attraction and eventual accumulation on target tooth surfaces.

Abstract: Chemical mechanical polishing (CMP) compositions and single CMP platen process for the removal of copper and barrier layer material from a microelectronic device substrate having same thereon. The process includes the in situ transformation of a copper removal CMP composition, which is used to selectively remove and planarize copper, into a barrier removal CMP composition, which is used to selectively remove barrier layer material, on a single CMP platen pad.

Abstract: Precipitated silica materials are provided for utilization as abrasives or thickeners within dentifrice formulations that simultaneously effectuate tubule blocking within tooth dentin to reduce dentin sensitivity. Such precipitated silica materials have sufficiently small particle sizes and exhibit certain ionic charge levels by, for example, adjusting the zeta potential properties of the precipitated silica materials through treatment with certain metals to permit effective static attraction and eventual accumulation within dentin tubules when applied to teeth from a dentifrice formulation.

Abstract: Chemical mechanical polishing (CMP) compositions and single CMP platen process for the removal of copper and barrier layer material from a microelectronic device substrate having same thereon. The process includes the in situ transformation of a Step I slurry formulation, which is used to selectively remove and planarize copper, into a Step II slurry formulation, which is used to selectively remove barrier layer material, on a single CMP platen pad.

Abstract: Novel acid-impregnated silica materials for use as environmental controls in air handling systems where highly efficient removal of ammonia and volatile amines from gaseous streams is required (e.g. clean rooms) are provided. Such silicas exhibit specific porosity and density measurements to provide a satisfactory support for an acid impregnant incorporated subsequent to initial solid silica particle production, in order to provide effective ammonia bonding sites. The combination of the silica support properties and the acid impregnant permits highly effective ammonia (or volatile amine) gas removal, resulting in excellent noxious gas removal efficiencies and capacities, particularly in comparison with prior media filtration products. Methods of using such acid-impregnated silica filter media and specific filter apparatuses are also encompassed within this invention.

Abstract: A method of passivating a CMP composition by dilution and determining the relationship between the extent of dilution and the static etch rate of copper. Such relationship may be used to control the CMP composition during the CMP polish to minimize the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions in the CMP composition and at the copper/CMP composition interface.

Abstract: Aerogel particles having a mean particle size less than 1 micron, products containing the same, processes of making the same, and uses thereof are described. A process of making the particle is also described wherein starting aerogel particles are homogenized or wet milled. The starting aerogel particles can be surface treated during the milling process to prevent agglomeration or aggregation. The aerogel particles can be used in a variety of products and applications.

Abstract: A chemical mechanical polishing process including a single copper removal CMP slurry formulation for planarization of a microelectronic device structure preferably having copper deposited thereon. The process includes the bulk removal of a copper layer using a first CMP slurry formulation having oxidizing agent, passivating agent, abrasive and solvent, and the soft polishing and over-polishing of the microelectronic device structure using a formulation including the first CMP slurry formulation and at least one additional additive. The CMP process described herein provides a high copper removal rate, a comparatively low barrier material removal rate, appropriate material selectivity ranges to minimize copper dishing at the onset of barrier material exposure, and good planarization efficiency.

Abstract: The invention provides a recording medium comprising a substrate having a glossy coating thereon, wherein the glossy coating comprises a binder and alumina particles that are aggregates of primary particles.

Abstract: This invention pertains to an ink jet recording medium comprises a flexible substrate and a coating composition coated on at least one surface of the substrate, wherein the coating composition comprises the product formed from the contact between fumed silica particles and at least one aminoorganosiloxane. The invention also pertains to a method for the preparation of such an ink jet recording medium and to methods for the preparation of a coating composition and a dispersion useful in the preparation of such an ink jet recording medium.

Abstract: A recording medium comprising a substrate having a glossy coating thereon, wherein the glossy coating comprises a binder and alumina particles that are aggregates of primary particles.

Abstract: This invention pertains to an ink jet recording medium comprises a flexible substrate and a coating composition coated on at least one surface of the substrate, wherein the coating composition comprises the product formed from the contact between fumed silica particles and at least one aminoorganosiloxane. The invention also pertains to a method for the preparation of such an ink jet recording medium and to methods for the preparation of a coating composition and a dispersion useful in the preparation of such an ink jet recording medium.

Abstract: This invention pertains to an ink jet recording medium comprises a flexible substrate and a coating composition coated on at least one surface of the substrate, wherein the coating composition comprises the product formed from the contact between fumed silica particles and at least one aminoorganosiloxane. The invention also pertains to a method for the preparation of such an ink jet recording medium and to methods for the preparation of a coating composition and a dispersion useful in the preparation of such an ink jet recording medium.

Abstract: This invention pertains to an ink jet recording medium comprises a flexible substrate and a coating composition coated on at least one surface of the substrate, wherein the coating composition comprises the product formed from the contact between fumed silica particles and at least one aminoorganosiloxane. The invention also pertains to a method for the preparation of such an ink jet recording medium and to methods for the preparation of a coating composition and a dispersion useful in the preparation of such an ink jet recording medium.

Abstract: The present invention provides a recording medium comprising a substrate having a glossy coating thereon, wherein the glossy coating comprises cationic silica. The cationic silica comprises silica particles having a mean diameter of less than about 1 &mgr;m that have been contacted with at least one aluminum compound. The present invention also provides an aqueous dispersion of cationic silica, a coating composition comprising it, and methods of preparing the dispersion, coating composition, and recording medium.