Abstract: A substrate handling system supplies new wafers to a vacuum chamber containing a lithography system, and outputs processed semiconductor wafers to an environment with normal atmospheric pressure. New wafers on a transplate pass by way of an air film track to a transload which feeds them from a load platform to a vacuum lock elevator. The inner door of the vacuum lock elevator opens and a completed transplate is transferred to the top shelf of the vacuum lock elevator. Next the vacuum lock elevator lifts to its upper position and the subsequent transfer of a new transplate onto a worktable occurs. There follows the closing of an inner door, (venting of the vacuum lock), the opening of an outer door, and the insertion of a new transplate from the load platform to the bottom shelf of the elevator. Finally, the completed transplate is removed. In cases where negative photoresists are used, this last step is replaced by routing the transplate to the post cure chamber for a period of up to 30 minutes.

Abstract: Apparatus for positioning a semiconductor wafer with respect to a localized vacuum envelope so as to maintain a prescribed gap between the tip of the vacuum envelope and the wafer includes an x-y table, a stage assembly movable along the z-axis for holding the wafer and a z-axis actuator assembly. The z-axis actuator assembly includes a plurality of fluid-containing bellows coupled between the x-y table and the stage assembly and a hydraulic controller operated by a linear stepper motor for varying the fluid volume in each of the bellows in response to an actuator control signal so as to move the stage assembly along the z-axis. The z-axis actuator assembly can further include a flexible disk positioned in the plane of x-y movement and coupled between the x-y table and the stage assembly for preventing lateral and rotational movement of the stage assembly relative to the x-y table. The positioning apparatus is suitable for use in an electron beam lithography system.

Abstract: Apparatus for controlling the gap between localized vacuum processing envelope apparatus and a workpiece as the workpiece, typically a semiconductor wafer, is moved laterally with respect to the envelope apparatus. The envelope apparatus includes an envelope which defines an internal vacuum processing zone and a generally planar tip spaced from the workpiece during processing by the gap. The gap control apparatus includes a gap sensor for measuring the gap, a control circuit for comparing the measured gap with a required gap and generating an error signal, and an actuating means for varying the gap in response to the error signal. The gap can be sensed by sensing the pressure level in the vacuum processing apparatus. The actuating means can include a plurality of piezoelectric actuators which can vary both the gap and the angle of the workpiece with respect to the tip of the vacuum processing apparatus.

Abstract: Localized vacuum envelope apparatus includes a housing member having a bottom plate with a downwardly extending first sleeve and an upwardly extending flange. The flange includes ports for vacuum pumping and is adapted for attachment to an electron beam column. The apparatus further includes a lower plate having a second downwardly extending sleeve and an upper plate having a third downwardly extending sleeve. The first, second and third sleeves, which can have a truncated conical shape and are concentric, define vacuum zones. Channels are provided for connecting the vacuum zones to individual ports. The tips of the sleeves are coplanar and form the tip of the vacuum envelope. A noncontacting graded vacuum seal is formed between the tip of the vacuum envelope and a workpiece. The housing member and the upper plate can be ferromagnetic material to provide double magnetic shielding.

Abstract: Equipment to visually identify insertion points to an operator of a pre-programmed, semi-automatic electronic assembly station. This equipment includes a pair of illuminators disposed at opposite ends of a cut-clinch mechanism and arranged to shine on the underside of the circuit board. The illuminators are carried by the cut-clinch mechanism and are free to move transversely and rotate axially, as the mechanism rotates and moves during the assembly steps.

Abstract: A dispensing device for small parts arranged in a compact shape from when the parts can be withdrawn from a single point including a plurality of vertically stacked trays slidably disposed upon banks of spaced flanges which are rotatable about a central axis of the device and reciprocable in a plane parallel to the central axis. The uppermost and lowermost trays in the stack are free to rotate with the flanges and the balance of the trays are restrained from rotation so as to be disengaged from one bank of flanges and received between the planes of another bank of flanges.

Abstract: The mechanism cuts component lead portions projecting from a support such as a circuit board though the leads may be spaced apart at different distances, and then clinches them against the board. Additionally, the mechanism is movable heightwise relative to the support for clearance purposes and adapted to be shifted both in X-Y directions and with selected radial orientation between preset angles. The clinching is done in opposite directions and normal to a line interconnecting the points from which the leads protrude thereby stabilizing the position of a component body.