Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted onto the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.

Abstract: A decoupling scheme is presented which is well suited for use with any type of integrated circuit package. In accordance with the present invention, a flat decoupling capacitor is attached directly to the top of an IC die and is electrically connected to the IC by means of raised conductive bumps provided either on the surface of the decoupling capacitor or on the IC die surface. These conductive bumps interconnect the internal electrodes of the capacitor to the power and ground circuits of the IC. The resulting decoupling scheme provides a decoupling loop with an inductance which is significantly lower than previously disclosed decoupling loops.

Abstract: High frequency noise is decoupled from power supplied to a Pin Grid Array (PGA) package by insertion of a decoupling capacitor between the PGA package and printed circuit board. The decoupling capacitor comprises a dielectric material sandwiched between a pair of conductors and having a plurality of leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit under a PGA package and correspond to the power and ground pin configuration of that PGA package.

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.