Patents by Inventor Michael S. Plante

Michael S. Plante has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230320049
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 5, 2023
    Inventors: Hoang Dinh DO, Robert Howard BOUTIER, JR., Jason L. STRADER, Michael S. PLANTE
  • Patent number: 11678470
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: June 13, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Hoang Dinh Do, Robert Howard Boutier, Jr., Jason L. Strader, Michael S. Plante
  • Publication number: 20160233173
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, a thermally-conductive EMI absorbing composite may comprise a polymer matrix including alumina, carbonyl iron powder, and silicon carbide. The thermally-conductive EMI absorber may have a thermal conductivity of greater than 2 Watts per meter per Kelvin.
    Type: Application
    Filed: April 10, 2015
    Publication date: August 11, 2016
    Inventors: Hoang Dinh Do, Robert Howard Boutier, JR., Jason L. Strader, Michael S. Plante