Abstract: A method for forming a polymer-filler composite having advantageous bound filler content, the method comprising (a) providing a guayule cement; (b) introducing particulate filler to the guayule cement to form a solution masterbatch; and (c) desolventizing the solution masterbatch to form a polymer-filler composite.

Abstract: An electromagnetic device includes: an electromagnetically reflective structure having an electrically conductive structure and a plurality of electrically conductive electromagnetic reflectors that are integrally formed with or are in electrical communication with the electrically conductive structure; wherein the plurality of reflectors are disposed relative to each other in an ordered arrangement; and, wherein each reflector of the plurality of reflectors forms a wall that defines and at least partially circumscribes a recess having an electrically conductive base that forms part of or is in electrical communication with the electrically conductive structure.

Abstract: An electromagnetic device includes: an electrically conductive ground structure; at least one dielectric resonator antenna (DRA) disposed on the ground structure; at least one electromagnetic (EM) beam shaper disposed proximate a corresponding one of the DRA; and, at least one signal feed disposed electromagnetically coupled to a corresponding one of the DRA. The at least one EM beam shaper having: an electrically conductive horn; a body of dielectric material having a dielectric constant that varies across the body of dielectric material in a specific direction; or, both the electrically conductive horn and the body of dielectric material.

Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Abstract: A grain-oriented M-type hexagonal ferrite has the formula MeFe12O19, and a dopant effective to provide planar magnetic anisotropy and magnetization in a c-plane, or a cone anisotropy, in the hexagonal crystallographic structure wherein Me is Sr+, Ba2+ or Pb2+, and wherein greater than 30%, preferably greater than 80%, of c-axes of the ferrite grains are aligned perpendicular to the c-plane.

Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate.

Abstract: An electromagnetic device includes: an electrically conductive ground structure; at least one dielectric resonator antenna (DRA) disposed on the ground structure; at least one electromagnetic (EM) beam shaper disposed proximate a corresponding one of the DRA; and, at least one signal feed disposed electromagnetically coupled to a corresponding one of the DRA. The at least one EM beam shaper having: an electrically conductive horn; a body of dielectric material having a dielectric constant that varies across the body of dielectric material in a specific direction; or, both the electrically conductive horn and the body of dielectric material.

Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate.

Abstract: A grain-oriented M-type hexagonal ferrite has the formula MeFe12O19, and a dopant effective to provide planar magnetic anisotropy and magnetization in a c-plane, or a cone anisotropy, in the hexagonal crystallographic structure wherein Me is Sr+, Ba2+ or Pb2+, and wherein greater than 30%, preferably greater than 80%, of c-axes of the ferrite grains are aligned perpendicular to the c-plane.

Abstract: An electromagnetic device includes: an electromagnetically reflective structure having an electrically conductive structure and a plurality of electrically conductive electromagnetic reflectors that are integrally formed with or are in electrical communication with the electrically conductive structure; wherein the plurality of reflectors are disposed relative to each other in an ordered arrangement; and, wherein each reflector of the plurality of reflectors forms a wall that defines and at least partially circumscribes a recess having an electrically conductive base that forms part of or is in electrical communication with the electrically conductive structure.

Abstract: A brace for a circuit board vertically mounted on a motherboard includes a first attachment member capable of attaching to an edge of the circuit board distal from the motherboard; a second attachment member capable of attaching to a side edge of the motherboard; and a rigid support connecting the first attachment member and the second attachment member. The rigid support is shaped such that the circuit board is held substantially perpendicular to the motherboard when the brace is attached. An interference minimization device for minimizing the interference of a circuit board vertically mounted on a motherboard includes an attachment member capable of attaching to the circuit board at an end distal from the motherboard; a mating wall that is substantially parallel to the circuit board and abuts the circuit board when the interference minimization device is attached to the circuit board; and a tapered wall that widens from the distal end of the circuit board towards the motherboard.

Abstract: A cable management system provides cable management for a switch chassis configured to receive a plurality of line card units. The cable management system comprises a cable guide arrangement configured to guide each of a plurality of cables from a line card such that the cables extend out from the line card unit and lie substantially within a plane.

Abstract: An injection/ejection mechanism is provided for mounting and dismounting of a unit in a chassis. The mechanism includes a drive screw that cooperates with a threaded barrel, the threaded barrel being rotatable for engagement and disengagement with at least one chassis component. The drive screw can be rotated in a first rotational direction to urge the threaded barrel in a first longitudinal direction against at least one chassis component for mounting of the unit and can be rotated in an opposite rotational direction to urge the threaded barrel in an opposite longitudinal direction against at least one chassis component for dismounting of the unit.

Abstract: An expansion card carrier is disclosed, the expansion card carrier including a top portion for covering an expansion card, at least one side portion for supporting the top portion, and at least one pair of card guides for allowing an expansion card to slide along into the expansion card carrier. A method for assembling an expansion card carrier is also disclosed, the method including casting a panel including a top portion for covering an expansion card and at least one side portion for supporting the top portion, forming at least one side portion by deforming the panel, and attaching at least one pair of card guides inside the expansion card carrier for allowing an expansion card to slide along into the expansion card carrier.

Abstract: A brace for a circuit board vertically mounted on a motherboard includes a first attachment member capable of attaching to an edge of the circuit board distal from the motherboard; a second attachment member capable of attaching to a side edge of the motherboard; and a rigid support connecting the first attachment member and the second attachment member. The rigid support is shaped such that the circuit board is held substantially perpendicular to the motherboard when the brace is attached. An interference minimization device for minimizing the interference of a circuit board vertically mounted on a motherboard includes an attachment member capable of attaching to the circuit board at an end distal from the motherboard; a mating wall that is substantially parallel to the circuit board and abuts the circuit board when the interference minimization device is attached to the circuit board; and a tapered wall that widens from the distal end of the circuit board towards the motherboard.

Abstract: An expansion card carrier is disclosed, the expansion card carrier including a top portion for covering an expansion card, at least one side portion for supporting the top portion, and at least one pair of card guides for allowing an expansion card to slide along into the expansion card carrier. A method for assembling an expansion card carrier is also disclosed, the method including casting a panel including a top portion for covering an expansion card and at least one side portion for supporting the top portion, forming at least one side portion by deforming the panel, and attaching at least one pair of card guides inside the expansion card carrier for allowing an expansion card to slide along into the expansion card carrier.

Abstract: A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise the crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, of the liquid crystalline polymer layer by at least about 10° C.

Abstract: An injection/ejection mechanism is provided for mounting and dismounting of a unit in a chassis. The mechanism includes a drive screw that cooperates with a threaded barrel, the threaded barrel being rotatable for engagement and disengagement with at least one chassis component. The drive screw can be rotated in a first rotational direction to urge the threaded barrel in a first longitudinal direction against at least one chassis component for mounting of the unit and can be rotated in an opposite rotational direction to urge the threaded barrel in an opposite longitudinal direction against at least one chassis component for dismounting of the unit.

Abstract: A circuit assembly comprises two or more circuit laminates, each comprising a conductive metal layer disposed on a poly(arylene ether ketone) substrate layer, wherein at least one of the conductive metal layers has been patterned to form a circuit, and a bond ply layer comprising a thermoplastic or thermosetting material. The thermoplastic bond ply has a melting point between 250° C. and 370° C., a decomposition temperature greater than about 290° C. and a dissipation factor of less than 0.01 at 10 GHz. The thermoset bond ply has a dissipation factor less than 0.01 at 10 GHz and a decomposition temperature greater than about 290° C. after lamination. Methods of forming the above circuit assemblies are also disclosed.