Patents by Inventor Michael Sackrison

Michael Sackrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11011018
    Abstract: Systems and methods for purchasing credits are described. The system includes a plurality of electronic transaction terminals, an activity table, a computing device, a financial account server, and a credit system. The electronic transaction terminals include a handheld device that receives patron input and are located at an activity table. The electronic transaction terminals are in electronic communication with the computing device and provide an electronic transaction request instruction. The system generates from the electronic transaction request instruction, an electronic transaction request that is communicated from the computing device to the financial account server. The computing device then receives an electronic transaction approval from the financial account server and generates an authorization to dispense credits to a patron.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: May 18, 2021
    Assignee: AUTOMATED CASHLESS SYSTEMS, INC.
    Inventors: Stephen L. Warner, Michael Sackrison, Michael Daly
  • Publication number: 20200226881
    Abstract: A gaming system and method for enabling financial transactions in a gaming environment are described. The gaming system includes an electronic funds transfer (EFT) terminal, a networkable component, a financial network, and a Slot Accounting System (SAS). The networkable component retrieves transaction information related to a fund transfer request. The networkable component can then independently determine that the fund transfer request complies with the applicable gaming limits and gaming rules. Compliant transactions that are approved by the financial network(s) are submitted to the SAS by the networkable component for generation of a corresponding voucher validation code.
    Type: Application
    Filed: November 7, 2019
    Publication date: July 16, 2020
    Applicant: AUTOMATED CASHLESS SYSTEMS, INC.
    Inventors: Stephen L. Warner, Michael Sackrison, Shawn G. Quick, Noah Vrudny
  • Patent number: 10706680
    Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: July 7, 2020
    Assignee: AUTOMATED CASHLESS SYSTEMS, INC.
    Inventors: Stephen L. Warner, Michael Sackrison, Shawn G. Quick, Noah Vrudny, Michael Daly
  • Publication number: 20200066095
    Abstract: Systems and methods for purchasing credits are described. The system includes a plurality of electronic transaction terminals, an activity table, a computing device, a financial account server, and a credit system. The electronic transaction terminals include a handheld device that receives patron input and are located at an activity table. The electronic transaction terminals are in electronic communication with the computing device and provide an electronic transaction request instruction. The system generates from the electronic transaction request instruction, an electronic transaction request that is communicated from the computing device to the financial account server. The computing device then receives an electronic transaction approval from the financial account server and generates an authorization to dispense credits to a patron.
    Type: Application
    Filed: March 4, 2019
    Publication date: February 27, 2020
    Applicant: AUTOMATED CASHLESS SYSTEMS, INC.
    Inventors: Stephen L. Warner, Michael Sackrison, Michael Daly
  • Patent number: 10223866
    Abstract: Systems, and methods are provided for the electronic purchase of gaming or amusement credits using a transaction device at a patron's location to apply funds from a financial account to the purchase of credits for use with an amusement or gaming device, system, or point of other wagering activity. Such credits are provided at the patron's location in the form of a printed ticket or other physical indicia of equivalent value, credits appearing in the credit meter and on the display of a gaming device, credit issued to a player card confirmed at the patron's location, credit issued to a debit card confirmed at the patron's location, and/or cash or other monetary-equivalents. In addition, physical confirmation of the completed electronic transaction from the patron's financial account may be concurrently provided to the patron in the form of a receipt.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: March 5, 2019
    Assignee: Automated Cashless Systems, Inc.
    Inventors: Stephen Warner, Michael Sackrison, Michael Daly
  • Publication number: 20180130295
    Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.
    Type: Application
    Filed: July 24, 2017
    Publication date: May 10, 2018
    Applicant: AUTOMATED CASHLESS SYSTEMS, INC.
    Inventors: Stephen L. Warner, Michael Sackrison, Shawn G. Quick, Noah Vrudny, Michael Daly
  • Patent number: 9728039
    Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.
    Type: Grant
    Filed: September 27, 2015
    Date of Patent: August 8, 2017
    Assignee: AUTOMATED CASH SYSTEMS, INC.
    Inventors: Stephen L. Warner, Michael Sackrison, Shawn Quick, Noah Vrudny, Michael Daly
  • Publication number: 20160027252
    Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.
    Type: Application
    Filed: September 27, 2015
    Publication date: January 28, 2016
    Applicant: Automated Cash Systems, Inc.
    Inventors: Stephen L. Warner, Michael Sackrison, Shawn Quick, Noah Vrudny, Michael Daly
  • Publication number: 20150187177
    Abstract: Systems, and methods are provided for the electronic purchase of gaming or amusement credits using a transaction device at a patron's location to apply funds from a financial account to the purchase of credits for use with an amusement or gaming device, system, or point of other wagering activity. Such credits are provided at the patron's location in the form of a printed ticket or other physical indicia of equivalent value, credits appearing in the credit meter and on the display of a gaming device, credit issued to a player card confirmed at the patron's location, credit issued to a debit card confirmed at the patron's location, and/or cash or other monetary-equivalents. In addition, physical confirmation of the completed electronic transaction from the patron's financial account may be concurrently provided to the patron in the form of a receipt.
    Type: Application
    Filed: January 28, 2015
    Publication date: July 2, 2015
    Inventors: Stephen Warner, Michael Sackrison, Michael Daly
  • Patent number: 7843074
    Abstract: A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: November 30, 2010
    Assignee: Lumination LLC
    Inventors: Xiang Gao, Michael Sackrison, Hari S. Venugopalan
  • Publication number: 20100181584
    Abstract: A light emitting device includes a stack of semiconductor layers defining a light emitting pn junction and a dielectric layer disposed over the stack of semiconductor layers. The dielectric layer has a refractive index substantially matching a refractive index of the stack of semiconductor layers. The dielectric layer has a principal surface distal from the stack of semiconductor layers. The distal principal surface includes patterning, roughening, or texturing configured to promote extraction of light generated in the stack of semiconductor layers.
    Type: Application
    Filed: July 11, 2006
    Publication date: July 22, 2010
    Inventors: Xiang Gao, Hari S. Venugopalan, Michael Sackrison, Ivan Eliashevich
  • Patent number: 7718449
    Abstract: A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: May 18, 2010
    Assignee: Lumination LLC
    Inventors: Xiang Gao, Michael Sackrison
  • Publication number: 20080121902
    Abstract: A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222).
    Type: Application
    Filed: September 7, 2006
    Publication date: May 29, 2008
    Inventors: Michael Sackrison, Xiang Gao, Srinath K. Aanegola, Hari S. Venugopalan
  • Publication number: 20080061312
    Abstract: A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.
    Type: Application
    Filed: September 12, 2006
    Publication date: March 13, 2008
    Inventors: Xiang Gao, Michael Sackrison, Hari S. Venugopalan
  • Publication number: 20070202623
    Abstract: A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.
    Type: Application
    Filed: October 27, 2006
    Publication date: August 30, 2007
    Inventors: Xiang Gao, Michael Sackrison
  • Publication number: 20070145379
    Abstract: A light emitting device (A) includes a semiconductor die (100).
    Type: Application
    Filed: December 22, 2004
    Publication date: June 28, 2007
    Inventors: Ivan Eliashevich, Hari Venugopalan, Xiang Gao, Michael Sackrison
  • Publication number: 20070004088
    Abstract: In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
    Type: Application
    Filed: July 7, 2006
    Publication date: January 4, 2007
    Inventors: Michael Sackrison, Xiang Gao, Bryan Shelton, Ivan Eliashevich
  • Publication number: 20060202223
    Abstract: In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is removed. The entire submount is immersed in the etchant solution, exposed to the light for a prespecified period of time, removed from the solution, dried and diced into a plurality of LEDs., The LEDs are immediately packaged without any further processing.
    Type: Application
    Filed: March 9, 2005
    Publication date: September 14, 2006
    Inventors: Michael Sackrison, Hari Venugopalan, Xiang Gao
  • Patent number: 7087463
    Abstract: In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: August 8, 2006
    Assignee: GELcore, LLC
    Inventors: Michael Sackrison, Xiang Gao, Bryan S. Shelton, Ivan Eliashevich
  • Publication number: 20060030125
    Abstract: In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
    Type: Application
    Filed: August 4, 2004
    Publication date: February 9, 2006
    Inventors: Michael Sackrison, Xiang Gao, Bryan Shelton, Ivan Eliashevich