Patents by Inventor Michael Sackrison
Michael Sackrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11011018Abstract: Systems and methods for purchasing credits are described. The system includes a plurality of electronic transaction terminals, an activity table, a computing device, a financial account server, and a credit system. The electronic transaction terminals include a handheld device that receives patron input and are located at an activity table. The electronic transaction terminals are in electronic communication with the computing device and provide an electronic transaction request instruction. The system generates from the electronic transaction request instruction, an electronic transaction request that is communicated from the computing device to the financial account server. The computing device then receives an electronic transaction approval from the financial account server and generates an authorization to dispense credits to a patron.Type: GrantFiled: March 4, 2019Date of Patent: May 18, 2021Assignee: AUTOMATED CASHLESS SYSTEMS, INC.Inventors: Stephen L. Warner, Michael Sackrison, Michael Daly
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Publication number: 20200226881Abstract: A gaming system and method for enabling financial transactions in a gaming environment are described. The gaming system includes an electronic funds transfer (EFT) terminal, a networkable component, a financial network, and a Slot Accounting System (SAS). The networkable component retrieves transaction information related to a fund transfer request. The networkable component can then independently determine that the fund transfer request complies with the applicable gaming limits and gaming rules. Compliant transactions that are approved by the financial network(s) are submitted to the SAS by the networkable component for generation of a corresponding voucher validation code.Type: ApplicationFiled: November 7, 2019Publication date: July 16, 2020Applicant: AUTOMATED CASHLESS SYSTEMS, INC.Inventors: Stephen L. Warner, Michael Sackrison, Shawn G. Quick, Noah Vrudny
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Patent number: 10706680Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.Type: GrantFiled: July 24, 2017Date of Patent: July 7, 2020Assignee: AUTOMATED CASHLESS SYSTEMS, INC.Inventors: Stephen L. Warner, Michael Sackrison, Shawn G. Quick, Noah Vrudny, Michael Daly
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Publication number: 20200066095Abstract: Systems and methods for purchasing credits are described. The system includes a plurality of electronic transaction terminals, an activity table, a computing device, a financial account server, and a credit system. The electronic transaction terminals include a handheld device that receives patron input and are located at an activity table. The electronic transaction terminals are in electronic communication with the computing device and provide an electronic transaction request instruction. The system generates from the electronic transaction request instruction, an electronic transaction request that is communicated from the computing device to the financial account server. The computing device then receives an electronic transaction approval from the financial account server and generates an authorization to dispense credits to a patron.Type: ApplicationFiled: March 4, 2019Publication date: February 27, 2020Applicant: AUTOMATED CASHLESS SYSTEMS, INC.Inventors: Stephen L. Warner, Michael Sackrison, Michael Daly
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Patent number: 10223866Abstract: Systems, and methods are provided for the electronic purchase of gaming or amusement credits using a transaction device at a patron's location to apply funds from a financial account to the purchase of credits for use with an amusement or gaming device, system, or point of other wagering activity. Such credits are provided at the patron's location in the form of a printed ticket or other physical indicia of equivalent value, credits appearing in the credit meter and on the display of a gaming device, credit issued to a player card confirmed at the patron's location, credit issued to a debit card confirmed at the patron's location, and/or cash or other monetary-equivalents. In addition, physical confirmation of the completed electronic transaction from the patron's financial account may be concurrently provided to the patron in the form of a receipt.Type: GrantFiled: January 28, 2015Date of Patent: March 5, 2019Assignee: Automated Cashless Systems, Inc.Inventors: Stephen Warner, Michael Sackrison, Michael Daly
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Publication number: 20180130295Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.Type: ApplicationFiled: July 24, 2017Publication date: May 10, 2018Applicant: AUTOMATED CASHLESS SYSTEMS, INC.Inventors: Stephen L. Warner, Michael Sackrison, Shawn G. Quick, Noah Vrudny, Michael Daly
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Patent number: 9728039Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.Type: GrantFiled: September 27, 2015Date of Patent: August 8, 2017Assignee: AUTOMATED CASH SYSTEMS, INC.Inventors: Stephen L. Warner, Michael Sackrison, Shawn Quick, Noah Vrudny, Michael Daly
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Publication number: 20160027252Abstract: A client device, a system and a method for enabling financial transactions for an electronic gaming machine is described. The client device includes an electronic gaming machine processor, a printer, a printer sharing module and a controller. The printer sharing module is electrically coupled to the printer and the electronic gaming machine processor. The controller is electrically coupled to the printer sharing module. The controller reroutes the communications between the electronic gaming machine processor and the printer and allows the controller to communicate with the printer so that the controller instructs the printer to print a voucher. The system also includes a wireless communications module that enables communications with at least one other wireless communication module over short distances using point to point or broadcast packets that allow for bi-directional data transmission between each client device located on a casino gaming floor.Type: ApplicationFiled: September 27, 2015Publication date: January 28, 2016Applicant: Automated Cash Systems, Inc.Inventors: Stephen L. Warner, Michael Sackrison, Shawn Quick, Noah Vrudny, Michael Daly
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Publication number: 20150187177Abstract: Systems, and methods are provided for the electronic purchase of gaming or amusement credits using a transaction device at a patron's location to apply funds from a financial account to the purchase of credits for use with an amusement or gaming device, system, or point of other wagering activity. Such credits are provided at the patron's location in the form of a printed ticket or other physical indicia of equivalent value, credits appearing in the credit meter and on the display of a gaming device, credit issued to a player card confirmed at the patron's location, credit issued to a debit card confirmed at the patron's location, and/or cash or other monetary-equivalents. In addition, physical confirmation of the completed electronic transaction from the patron's financial account may be concurrently provided to the patron in the form of a receipt.Type: ApplicationFiled: January 28, 2015Publication date: July 2, 2015Inventors: Stephen Warner, Michael Sackrison, Michael Daly
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Patent number: 7843074Abstract: A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.Type: GrantFiled: September 12, 2006Date of Patent: November 30, 2010Assignee: Lumination LLCInventors: Xiang Gao, Michael Sackrison, Hari S. Venugopalan
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Publication number: 20100181584Abstract: A light emitting device includes a stack of semiconductor layers defining a light emitting pn junction and a dielectric layer disposed over the stack of semiconductor layers. The dielectric layer has a refractive index substantially matching a refractive index of the stack of semiconductor layers. The dielectric layer has a principal surface distal from the stack of semiconductor layers. The distal principal surface includes patterning, roughening, or texturing configured to promote extraction of light generated in the stack of semiconductor layers.Type: ApplicationFiled: July 11, 2006Publication date: July 22, 2010Inventors: Xiang Gao, Hari S. Venugopalan, Michael Sackrison, Ivan Eliashevich
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Patent number: 7718449Abstract: A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.Type: GrantFiled: October 27, 2006Date of Patent: May 18, 2010Assignee: Lumination LLCInventors: Xiang Gao, Michael Sackrison
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Publication number: 20080121902Abstract: A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222).Type: ApplicationFiled: September 7, 2006Publication date: May 29, 2008Inventors: Michael Sackrison, Xiang Gao, Srinath K. Aanegola, Hari S. Venugopalan
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Publication number: 20080061312Abstract: A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.Type: ApplicationFiled: September 12, 2006Publication date: March 13, 2008Inventors: Xiang Gao, Michael Sackrison, Hari S. Venugopalan
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Publication number: 20070202623Abstract: A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.Type: ApplicationFiled: October 27, 2006Publication date: August 30, 2007Inventors: Xiang Gao, Michael Sackrison
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Publication number: 20070145379Abstract: A light emitting device (A) includes a semiconductor die (100).Type: ApplicationFiled: December 22, 2004Publication date: June 28, 2007Inventors: Ivan Eliashevich, Hari Venugopalan, Xiang Gao, Michael Sackrison
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Publication number: 20070004088Abstract: In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).Type: ApplicationFiled: July 7, 2006Publication date: January 4, 2007Inventors: Michael Sackrison, Xiang Gao, Bryan Shelton, Ivan Eliashevich
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Publication number: 20060202223Abstract: In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is removed. The entire submount is immersed in the etchant solution, exposed to the light for a prespecified period of time, removed from the solution, dried and diced into a plurality of LEDs., The LEDs are immediately packaged without any further processing.Type: ApplicationFiled: March 9, 2005Publication date: September 14, 2006Inventors: Michael Sackrison, Hari Venugopalan, Xiang Gao
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Patent number: 7087463Abstract: In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).Type: GrantFiled: August 4, 2004Date of Patent: August 8, 2006Assignee: GELcore, LLCInventors: Michael Sackrison, Xiang Gao, Bryan S. Shelton, Ivan Eliashevich
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Publication number: 20060030125Abstract: In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).Type: ApplicationFiled: August 4, 2004Publication date: February 9, 2006Inventors: Michael Sackrison, Xiang Gao, Bryan Shelton, Ivan Eliashevich