Abstract: A resin composition is used for forming a surface layer coating at least a part of an outer surface of a particle. The particle is adapted to be packed into a fracture formed in a subterranean formation, and contains a thermosetting resin and a hydrophilic polymer. It is preferred that the resin composition further contains a surfactant. According to the present invention, it is possible to provide an effect of preventing pieces of core particles from being scattered due to the action of a thermo-setting resin and an effect of improving compatibility with respect to water (that is, fluid repellent with respect to hydrocarbon) due to the action of a hydrophilic polymer in a synergistic manner. This increases conductivity of packed spaces of a subterranean formation (that is, fractures of the subterranean formation) in which coated particles are packed.

Abstract: A resin composition is used for forming a surface layer coating at least a part of an outer surface of a particle. The particle is adapted to be packed into a fracture formed in a subterranean formation, and contains a thermosetting resin and a hydrophilic polymer. It is preferred that the resin composition further contains a surfactant. According to the present invention, it is possible to provide an effect of preventing pieces of core particles from being scattered due to the action of a thermo-setting resin and an effect of improving compatibility with respect to water (that is, fluid repellent with respect to hydrocarbon) due to the action of a hydrophilic polymer in a synergistic manner. This increases conductivity of packed spaces of a subterranean formation (that is, fractures of the subterranean formation) in which coated particles are packed.

Abstract: An adhesive is disclosed for use in flexible circuitry, laminates and electrical products. The adhesive has improved flexibility and adhesive properties. It may be applied in solution form or may be cast as a free-standing film which is later heated and compressed to give adhesive properties. The adhesive comprises a phenol-aldehyde resin or other phenolic resin, an epoxy resin and an elastomer.

Abstract: An adhesive is disclosed for use in flexible circuitry, laminates and electrical products. The adhesive has improved flexibility and adhesive properties. It may be applied in solution form or may be cast as a free-standing film which is later heated and compressed to give adhesive properties. The adhesive comprises a phenolaldehyde resin or other phenolic resin, an epoxy resin and an elastomer.