Abstract: An imaging composition for radiation detection systems which includes an admixture of at least one non-heat treated, non-ground particulate semiconductor with a polymeric binder. The non-heat treated, non-ground particulate semiconductor is selected from mercuric iodide, lead iodide, bismuth iodide, thallium bromide and cadmium-zinc-telluride (CZT), and at least 90% of the semiconductor particulates have a grain size of less than 100 microns in their largest dimension. A radiation detector plate (10) for an imaging system includes a substrate (12) which serves as an electrode, at least one imaging composition layer (16) applied onto the substrate (12), and a second electrode (18) which is in electrical connection with the imaging composition (16) and connected (20, 22) to a high voltage bias.

Abstract: An element adapted for at least one use selected from high energy radiation detection, imaging and barrier use, which includes a planar substrate on a surface of which there is a layer polycrystalline mercuric iodide, which has been deposited from the vapor phase, having a thickness within the range of from more than 0.5 mm and up to about 10 mm. A process for preparing an element having such thicknesses. A planar substrate, having deposited on a surface thereof, a layer of mercuric iodide in at least two discrete adjacent sub-layers having a total thickness within the range of from greater than 0.5 mm to about 10 mm. A system adapted for at least one purpose selected from radiation detection, radiation imaging and high energy absorption, which includes an element having thicknesses as described above.

Abstract: A continuous multi-layer construction for detecting radiation including a polymer layer, a conducting electrode layer affixed to the polymer layer and a particle-in-binder composite layer affixed to the conducting electrode layer, where the composite layer absorbs photons. A process for fabricating continuous multi-layer constructions for detection of radiation including the following steps: depositing a conducting electrode layer onto a polymer film, applying at least one coating layer of a particle-in-binder composite onto the conducting electrode layer, and drying the at least one coating layer of the particle-in-binder composite.