Patents by Inventor Michael Schlectweg

Michael Schlectweg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Supply voltage decoupling device for HF amplifier circuits
    Patent number: 6653903
    Abstract: A device for decoupling a supply voltage for HF amplifier circuits is described which includes an output line for coupling out an amplified signal, wherein one end of the output line, which is not used for coupling out signals, is connected to a circuit element designed as decoupling circuit. The circuit element has a low ohmic d.c. resistance and presents an HF-power absorption capacity that increases as the frequency increases, thus constituting a reflection-free termination for high frequencies. The circuit element is preferably constituted by several discrete subcircuits connected in succession. The device permits the operation of integrated distributed amplifiers of high performance at a low power loss caused by the decoupling circuit.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: November 25, 2003
    Assignee: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Martin Leich, Michael Schlectweg
  • Supply voltage decoupling device for HF amplifier circuits
    Publication number: 20020014922
    Abstract: The invention relates to a device for decoupling a supply voltage for HF amplifier circuits, comprising an output line for coupling out an amplified signal, wherein one end of the output line, which is not used for coupling out signals, is connected to a circuit element designed as decoupling circuit. The circuit element has a low ohmic d.c. resistance and presents an HF-power absorption capacity that increases as the frequency increases, thus constituting a reflection-free termination for high frequencies. The circuit element is preferably constituted by several discrete subcircuits connected in succession.
    Type: Application
    Filed: July 24, 2001
    Publication date: February 7, 2002
    Applicant: Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Martin Leich, Michael Schlectweg