Abstract: An integrated component with integrated metal-insulator-metal capacitor and copper-containing interconnects is produced by, first of all, depositing a dielectric interlayer and an upper electrode on a lower electrode, made from copper, over the entire surface. Then, the metal-insulator-metal capacitor is patterned. The etching stops at the dielectric interlayer, which serves as an etch stop. This avoids short circuits between the upper electrode and the lower electrode.