Abstract: The invention provides a compound of formula (I), or pharmaceutically acceptable ester, amide, carbamate, solvate or salt thereof, including a salt of such an ester, amide or carbamate, wherein R1 is an optionally substituted phenyl, or an optionally substituted 5- or 6-membered aromatic heterocycle; and R2 is an optionally substituted 5- or 6-membered aromatic heterocycle. Also provided are pharmaceutical compositions comprising a compound of formula (I).

Abstract: The invention provides a compound of formula (I), or pharmaceutically acceptable ester, amide, carbamate, solvate or salt thereof, including a salt of such an ester, amide or carbamate, wherein R1 is an optionally substituted phenyl, or an optionally substituted 5- or 6-membered aromatic heterocycle; and R2 is an optionally substituted 5- or 6-membered aromatic heterocycle. Also provided are pharmaceutical compositions comprising a compound of formula (I).

Abstract: The invention provides a compound of formula (I), or pharmaceutically acceptable ester, amide, carbamate, solvate or salt thereof, including a salt of such an ester, amide or carbamate, wherein R1 is an optionally substituted phenyl, or an optionally substituted 5- or 6-membered aromatic heterocycle; and R2 is an optionally substituted 5- or 6-membered aromatic heterocycle. Also provided are pharmaceutical compositions comprising a compound of formula (I).

Abstract: In a process for the production of a flame-resistant, pourable, latently reactive, phenolically curable epoxy resin molding material for the encapsulating of electronic components, a latently reactive prepolymer epoxy resin mixture in powder form which is free of isocyanate groups is produced at reaction temperatures up to 200° C. from a thermally polymerizable, filler-containing reaction resin mixture of polyepoxy resin consisting of a mixture of bi-functional and multi-functional epoxy resins and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of >1:1 with a substituted imidazole as reaction accelerator in a concentration of 0.5 to 2.5% by weight, relative to polyepoxy resin, and the prepolymer epoxy resin mixture is mixed with a powdered filler-containing phenolic resin mixture in a molar ratio of the epoxy groups to the phenolic hydroxyl groups of 1:0.4 to 1:1.1.

Abstract: Epoxy resin mixtures suitable for producing halogen-free flame-retardant composites by the injection process comprise the following components: (A) a phosphorus-free aliphatic and/or aromatic and/or heterocyclic epoxy resin; (B) an epoxide group-containing phosphorus compound; (C) a phosphorus-modified epoxy resin with an epoxide value of from 0.02 to 1 mol/100 g, obtained by reacting polyepoxy compounds having at least two epoxide groups per molecule with phosphinic anhydrides and/or phosphonic anhydrides or with phosphonic monoesters, followed by thermal elimination of alcohol; and (D) as hardener, at least one primary or secondary aliphatic polyamine with NH and/or NH2 groups.

Abstract: Flame-resistantly formulated, flowable, latently reactive, phenolically curable epoxy-resin moulding compounds for the encapsulation of electronic components containing the following components:an epoxy-resin component obtained from a solvent-free reaction resin mixture of polyepoxy resin and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of 1.1 to 4 at a reaction temperature of up to 220.degree. C. in the presence of a reaction accelerator in a concentration of 0.5 to 2.5% and using triphenylphosphine oxide in a concentration of 0.05 to 10%, relative in each case to the reaction resin mixture,a hardener component containing at least two phenolic hydroxyl groups per molecule,inorganic filler,and standard additives.

Abstract: In a process for producing a prepolymer epoxy resin mixture with oxazolidinone structures, an insoluble reaction resin powder which has no isocyanate groups and consists of an epoxy resin mixture containing a reaction accelerator and filler and having isocyanurate structures, is fed to a continuously working reactor and reacted at temperatures up to 200.degree. C., with reactor temperature at 140.degree.-190.degree. C., and then the extruded material is cooled down to a temperature of <50.degree. C. with the aid of a cooling device mounted at the outlet die of the reactor.

Abstract: In a process for producing a prepolymer epoxy resin mixture with oxazolidinone structures, a filler-containing thermally polymerizable reaction resin mixture of polyepoxy resin, consisting of a mixture of di- and multifunctional epoxy resins, and polyisocyanate resin, with a molar ratio of the epoxy groups to the isocyanate groups of >1, is fed to a continuously working reactor. With substituted imidazole as reaction accelerator, amounting to 0.5-2.5% of the polyepoxy resin, the reaction resin mixture is then reacted at temperatures up to 200.degree. C., with reactor temperature at 140.degree.-190.degree. C., and following that the extruded material is cooled down to a temperature of <50.degree. C. with the aid of a cooling device mounted at the outlet die of the reactor.