Abstract: An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

Abstract: An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.

Abstract: A medical device for implantation within a patient comprising a lead body including a conductor within the lead body and a transducer supported by the lead body. The conductor is electrically coupled to the transducer by a conductive fluid, paste or gel. The conductive fluid, paste or gel may be contained within a well in the lead body. The transducer may be a MEMS chip and/or an integrated circuit and may perform any of a variety of functions such as sensing physiological data.

Abstract: An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

Abstract: A lead of an implantable medical device system that includes a sensor coupled to a lead body and extending from a proximal end to a distal end, and a distal lead adaptor having a first arm extending distally from the distal end of the sensor to a first arm end, a second arm extending distally from the distal end of the sensor to a second arm end, and a third arm extending between the first arm end and the second arm end, wherein the first arm, the second arm, and the third arm form an open portion.

Abstract: A lead of an implantable medical device system having an elongated lead body and a sensor coupled to the lead body and extending from a proximal end to a distal end. The sensor includes a first portion extending from a top to a bottom, and from a proximal end to a distal end and a second portion engaged against the first portion and extending from a top to a bottom, the top of the second portion extending from a proximal end to a distal end. A first flange extends proximally relative to the proximal end of the top of the second portion to a first flange end, and a second flange extends distally relative to the distal end of the top of the second portion to a second flange end, wherein the first flange end is aligned with the proximal end of the first portion and the second flange end is aligned with the distal end of the first portion.

Abstract: A lead of an implantable medical device system having an elongated lead body, a sensor coupled to the lead body and extending from a proximal end to a distal end, and a distal lead adaptor having a first arm extending distally from the distal end of the sensor to a first arm end, a second arm extending distally from the distal end of the sensor to a second arm end, and a third arm extending between the first arm end and the second arm end, wherein the first arm, the second arm, and the third arm form an open portion.

Abstract: This disclosure relates to implantable medical devices (IMDs); in particular, to medical electrical leads having an integrated sensor disposed in a hermetic package and said sensor package accommodates a torque coil and an elongated cable conductor extending therethrough. The integrated sensor can include a pressure sensor, an accelerometer, and the like. The coil and the cable can couple to pacing and sensing electrode coupled to the lead distal to the sensor package. The sensor package is compact, substantially circular in cross section and robust, in that the overall design promote mechanical stability.

Abstract: An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

Abstract: A driver and sensor assembly that is hermetically sealed so that the assemblies may be fully implanted in a being. The assemblies employ a transducer that has a longitudinal axis and that vibrates or picks up vibration in a direction substantially transverse to its longitudinal axis. A sheath covers the transducer and is hermetically sealed to a housing. Leads from a sound processor are coupled to the housing and the entire assembly is hermetically sealed.

Abstract: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled to the first substrate.

Abstract: An implantable pedometer for measuring the amount of joint use is disclosed. The implantable pedometer includes a sensor adapted for detecting indicators of joint usage. A counter is configured for storing count data corresponding to the number of indicators detected by the sensor and a telemetry circuit is configured for transmitting the count data outside of the body.

Abstract: A pressure module is provided which comprises a capsule having a cavity formed therein, and a pressure transducer disposed within the cavity of the capsule. A feedthrough pin, fixedly coupled to the capsule, extends into the capsule and is electronically coupled to the pressure transducer.

Abstract: A medical device for implantation within a patient comprising a lead body including a conductor within the lead body and a transducer supported by the lead body. The conductor is electrically coupled to the transducer by a conductive fluid, paste or gel. The conductive fluid, paste or gel may be contained within a well in the lead body. The transducer may be a MEMS chip and/or an integrated circuit and may perform any of a variety of functions such as sensing physiological data.

Abstract: Implantable medical devices with coatings formed by atomic layer deposition and methods of applying such coatings to implantable medical devices are disclosed. The medical devices may include electrical feedthroughs and media exposed integrated circuits and/or transducer systems, as well as others. The coatings may improve, among other things, hermeticity, biocompatibility, biostability, surface characteristics, and electrical properties.

Abstract: An implantable pedometer for measuring the amount of joint use is disclosed. The implantable pedometer includes a sensor adapted for detecting indicators of joint usage. A counter is configured for storing count data corresponding to the number of indicators detected by the sensor and a telemetry circuit is configured for transmitting the count data outside of the body.

Abstract: Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

Abstract: A pressure module is provided which comprises a capsule having a cavity formed therein, and a pressure transducer disposed within the cavity of the capsule. A feedthrough pin, fixedly coupled to the capsule, extends into the capsule and is electronically coupled to the pressure transducer.

Abstract: A pressure module is provided which comprises a capsule having a cavity formed therein, and a pressure transducer disposed within the cavity of the capsule. A feedthrough pin, fixedly coupled to the capsule, extends into the capsule and is electronically coupled to the pressure transducer.

Abstract: Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.