Abstract: A shingle coating asphalt composition is provided that is produced from a paving grade asphalt. The asphalt composition comprises a paving-grade asphalt that has been modified with one or more polymer additives; and a secondary additive comprising one or more of a viscosity reducing agent, a wax, a salt of a fatty acid ester, and an amide of a fatty acid. The shingle coating asphalt coating composition is used to make a shingle. The shingle includes a substrate, the asphalt, and roofing granules.

Abstract: Semiconductor technology requires the use of object holders, which are capable of holding wafers securely, also during rotation. In order to save time and expense, such holders should be suitable for integration directly into a processing facility, wherever possible. According to the invention it is proposed to provide centrally mounted holders which comprise support surfaces for the wafer and pivotable gripper fingers, in which the gripper fingers are pretensioned by means of at least one pretension element in the holding position and are actuated through one opening mechanism, in which at least one opening mechanism and at least one pretension element are integrated in the central clamping arm fixture and/or in the clamping arms.

Abstract: In view of the miniaturization of semiconductor components, the prevention of particles and other defects on the wafer surface during production is of great importance. The inspection should proceed as process-oriented as possible. For this purpose, devices are needed which on the one hand, are of very compact construction, while on the other hand, they still are equipped with measuring systems meeting the highest requirements. The device according to the invention for measuring surface defects, comprising a sample holder, a rotation drive for the sample holder, wherein the rotational axis runs perpendicular to the sample surface to be measured, an optical measuring system (10) for measuring scattered light, as well as at least one linear drive (23) for the measuring system, wherein the rotational direction is radial to the rotational axis of the sample holder, is capable of scanning the entire sample surface (16).

Abstract: Chalcogenide nanowires and other micro- and nano scale structures are grown on a preselected portion of on a substrate. They are amorphous and of uniform composition and can be grown by a sublimation-condensation process onto the surface of an amorphous substrate. Among other uses, these structures can be used as coatings on optical fibers, as coatings on implants, as wispering galleries, in electrochemical devices, and in nanolasers.

Abstract: Semiconductor technology requires the use of object holders, which are capable of holding wafers securely, also during rotation. In order to save time and expense, such holders should be suitable for integration directly into a processing facility, wherever possible. According to the invention it is proposed to provide centrally mounted holders which comprise support surfaces for the wafer and pivotable gripper fingers, in which the gripper fingers are pretensioned by means of at least one pretension element in the holding position and are actuated through one opening mechanism, in which at least one opening mechanism and at least one pretension element are integrated in the central clamping arm fixture and/or in the clamping arms.

Abstract: A measurement module for measuring particularly the surface of wafers is described, which comprises a measuring device and a measuring table that has a wafer table equipped with a rotary drive. The design of this measurement module should be as compact as possible. To this end, the wafer table (10) is cup-shaped with at least one support edge (13, 14) for a wafer (4, 4a, 4b), which is provided with an adhesive material. A wafer aligning device (30) is arranged in the interior of the wafer table (10). A displaceable measuring head (7) in which a measuring device and a notch detector are integrated is disposed above the wafer table.

Abstract: In view of the miniaturization of semiconductor components, the prevention of particles and other defects on the wafer surface during production is of great importance. The inspection should proceed as process-oriented as possible. For this purpose, devices are needed which on the one hand, are of very compact construction, while on the other hand, they still are equipped with measuring systems meeting the highest requirements.