Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the backmetal layer within the singulation lines, and separating portions of the backmetal layer using a fluid.

Abstract: In one embodiment, a packaged semiconductor device having enhanced thermal dissipation characteristics includes a lead frame structure and a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged semiconductor device further includes a non-planar, stepped or undulating attachment structure coupling the current carrying electrode to the lead frame. A high thermal conductivity mold compound and thin package profile further enhance thermal dissipation.

Abstract: In one embodiment, an electronic device package (1) includes a leadframe (2) with a flag (3). An electronic chip (8) is attached to the flag (3) with a die attach layer (9). A trench (16) having curved sidewalls is formed in the flag (3) in proximity to the electronic chip (8) and surrounds the periphery of the chip (8). An encapsulating layer (19) covers the chip (8), portions of the flag (3), and at least a portion of the curved trench (16). The curved trench (16) reduces the spread of die attach material across the flag (3) during chip attachment, which reduces chip and package cracking problems, and improves the adhesion of encapsulating layer (19). The shape of the curved trench (16) prevents flow of die attach material into the curved trench (16), which allows the encapsulating layer (19) to adhere to the surface of the curved trench (16).

Abstract: A semiconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with the color of the semiconductor die. The coating layer is patterned to expose a portion of the second surface to reveal information pertaining to the semiconductor device. The coating layer is patterned by directing a radiation beam (30) such as a laser to selectively remove material from the coating layer.

Abstract: A semiconductor component having a positionally adaptable locking feature and a method for manufacturing the semiconductor component using a wire bond tool. A conductive support substrate having a flag portion, a lead portion and tie-bars is provided. A semiconductor chip is coupled to the flag portion of the conductive support substrate. A conductive attachment structure couples the semiconductor chip to the lead portion. One or more positionally adaptable locking features are formed on the conductive substrate such that they extend upward from the substrate. Alternatively, the positionally adaptable locking features can be formed on the conductive attachment structure, the semiconductor chip, the tie-bars, other circuit elements, or combinations thereof. The positionally adaptable locking features may be bonding wires, wire bond posts, or the like.

Abstract: A semiconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with the color of the semiconductor die. The coating layer is patterned to expose a portion of the second surface to reveal information pertaining to the semiconductor device. The coating layer is patterned by directing a radiation beam (30) such as a laser to selectively remove material from the coating layer.

Abstract: A seconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with the color of the semiconductor die. The coating layer is patterned to expose a portion of the second surface to reveal information pertaining to the semiconductor device. The coating layer is patterned by directing a radiation beam (30) such as a laser to selectively remove material from the coating layer.

Abstract: In one embodiment, an electronic device package (1) includes a leadframe (2) with a flag (3). An electronic chip (8) is attached to the flag (3) with a die attach layer (9). A trench (16) having curved sidewalls is formed in the flag (3) in proximity to the electronic chip (8) and surrounds the periphery of the chip (8). An encapsulating layer (19) covers the chip (8), portions of the flag (3), and at least a portion of the curved trench (16). The curved trench (16) reduces the spread of die attach material across the flag (3) during chip attachment, which reduces chip and package cracking problems, and improves the adhesion of encapsulating layer (19). The shape of the curved trench (16) prevents flow of die attach material into the curved trench (16), which allows the encapsulating layer (19) to adhere to the surface of the curved trench (16).

Abstract: The catheter includes an outer tube with an inlet end portion and a stop formed on the inlet end portion. The stop, which normally assumes a collapsed orientation, is moveable between a collapsed orientation and a deployed orientation. The catheter may include at least one of a diagnostic port disposed on the outer tube proximate the bottom of the stop, a locking device proximate the bottom of the catheter for securing the stop in the deployed orientation, and an actuator for operatively moving the stop between collapsed and deployed orientations. Applying force to the actuator moves the stop from the collapsed orientation to the deployed orientation. The actuator may also include a fail-safe mechanism designed to fail when a predetermined amount of force is applied to the actuator.

Abstract: A seconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with the color of the semiconductor die. The coating layer is patterned to expose a portion of the second surface to reveal information pertaining to the semiconductor device. The coating layer is patterned by directing a radiation beam (30) such as a laser to selectively remove material from the coating layer.

Abstract: The catheter includes an outer tube with an inlet end portion and a stop formed on the inlet end portion. The stop, which normally assumes a collapsed orientation, is moveable between a collapsed orientation and a deployed orientation. The catheter may include at least one of a diagnostic port disposed on the outer tube proximate the bottom of the stop, a locking device proximate the bottom of the catheter for securing the stop in the deployed orientation, and an actuator for operatively moving the stop between collapsed and deployed orientations. Applying force to the actuator moves the stop from the collapsed orientation to the deployed orientation. The actuator may also include a fail-safe mechanism designed to fail when a predetermined amount of force is applied to the actuator.

Abstract: A method and apparatus for treating kidney stones in the urinary tract uses a surgical assembly to remove kidney stones. The surgical assembly is inserted into the urinary tract along a guide wire positioned in the surgical assembly. Fluid, such as lidocaine gel and contrast solution, and a stone-removing device enter the urinary tract via channels located in the surgical assembly. Once the surgical assembly is proximate the stone, the physician engages and retains the stone with the stone-removing device. An exemplary stone-removing device includes an expandable spacer and an adjustable stone retainer. When in an expanded position, the spacer engages a portion of the urinary tract. The stone retainer, confined within the expanded spacer, engages and retains the stone while the spacer spaces the urinary tract from the stone retainer. The stone is removed by removing the surgical assembly containing the stone from the urinary tract.

Abstract: A method and apparatus for treating urinary tract stones in the urinary tract uses an adjustable stone retainer to engage and retain a urinary tract stone and a central electrode to apply disintegrating energy to the retained urinary tract stone. A physician inserts a collapsed retainer assembly, including the adjustable stone retainer and the central electrode enclosed in an outer sheath, into the urinary tract. Once the probe is proximate the urinary tract stone, the physician extends the stone retainer relative to the outer sheath and engages and retains the urinary tract stone in the stone retainer. While retaining the urinary tract stone in the stone retainer, the physician applies disintegrating energy with the central electrode to the urinary tract stone until the urinary tract stone disintegrates. Once the treatment is complete, the physician retracts the stone retainer into the outer sheath and removes the collapsed retainer assembly from the urinary tract.