Abstract: A scanning probe microscope having a probe attachment fixture, to which a probe assembly is removably attached during measurements, driven in an engagement direction, and a sample stage driven in scanning directions perpendicular to the engagement direction includes a buffer with a number of buffer stations within the sample stage. When the stage is driven so that one of the buffer stations is in alignment with the attachment fixture, and when the attachment fixture is driven in the engagement direction to be in proximity to the buffer station, the probe assembly is selectively transferred in either direction between the attachment fixture and the buffer station. In a preferred embodiment, probe assemblies are transferred on transfer pallets, and a stationary magazine is provided for storing these pallets, which are transferred in either direction between the magazine and the buffer.

Abstract: Disclosed is a Mini Probe Positioning Actuator which is low in cost and mass, capable of high accelerations, relatively long stroke and compact packaging. The probe positioning actuator is composed of a pair of substantially parallel cantilevered beams, each beam being comprised of flexible, signal carrying cable formed of a polyimide composition which allows for the probe tip to be suspended from and form part of the armature of the actuator. The armature also includes a pair of oppositely wound coils intermediate the beams, which coils coact electromagnetically with a pair of spaced apart but fixedly positioned (relative to the coils/armature) magnets forming a motor for effecting armature and thus probe tip movement. The light mass of the coils and armature and the dual functional purpose of the suspension beams serves to make the probe actuator highly accurate and sensitive while allowing for reliable operation.

Abstract: In ultrasonic wirebonding apparatus, vibrations produced using a tubular piezoelectric (piezoceramic) actuator, driven by electrical current at an ultrasonic frequency, are used to provide energy for the wirebonding process. An assembly including means for mounting the actuator at a proximal end, the actuator itself, and a bonding tip extending from a distal end of the actuator, are moved by a carrier between the various points at which wirebonding is to occur. The bonding wire is fed through a passageway in this assembly. The carrier slides on a first carriage for movement into engagement with the workpiece. The first carriage slides in a first direction on a second carriage, which in turn slides in a second direction, to move between points at which wirebonding is to occur. The workpieces, such as circuit chips being manufactured, are moved into a workspace for wirebonding, are held therein during processing, and are subsequently removed from the workspace.

Abstract: Disclosed is a Probe Positioning Actuator which is low in cost and mass, capable of high accelerations, relatively long stroke and compact packaging, as well as high in efficiency. The actuator assembly comprises a frame, and at least one pair of spaced apart, laterally extending, conductor carrying, flexible beams attached to the frame. A non-magnetic armature, substantially U-shaped in cross section, is attached adjacent or approximate the extended terminal ends of the beams, and a probe is attached to the base of the "U" of the armature for contacting selected points in the electrical circuit associated with the device being tested. The heart of the actuator includes a coil mounted on the upstanding legs of the U-shaped armature and arranged so that the axis of the coil is perpendicular to the base of the armature but substantially parallel to the probe tip.

Abstract: A digital and analog controller for controlling a high-speed probe actuator is disclosed. This method and system provide the probe actuator system with improved damping ratio and reduced impact force, so the throughput of the tester is increased with fast settling actuator armature. With this method and system, the steady-state probe force is less sensitive to the servo system, test probe and variation in the probing distance d. An electronic circuit, which consists of analog operational amplifiers, monostable multivibrators, and D flip-flops, is presented for low-cost applications.

Abstract: An ultrasonic wirebonding assembly, consisting of an actuator producing vibrations at an ultrasonic frequency and a tip transmitting such vibrations to a bonding wire atop a terminal to which the wire is to be bonded, is moved among positions on a circuit chip where wirebonding operations are to occur by means of a linkage. The linkage consists of first and second drive arms, each of which is pivoted on a single stationary shaft, a drive link pivoted on the second drive arm, and a connecting link extending between the drive link and the first drive arm, being pivoted at each end. Each arm is independently driven using a motor having a coil moving over an arcuate permanent magnet. The wirebonding assembly is driven vertically, downward in a direction of engagement with the workpiece and upward in a direction of disengagement with the workpiece, on the drive link by means of a linear motor.

Abstract: Probing system performance is improved by dynamically positioning a test probe at a test site during the gantry settling interval using a high performance secondary positioner to compensate for the inherent moving mass oscillational displacements. A primary positioner positions the gantry and its associated test probe to within a predetermined axis distance of the test site and a secondary positioner dynamically maintains the test probe at a target position corresponding to the test site during the settling interval by imparting compensating displacements to the test probe to counteract the displacement errors incurred as the primary positioner attempts to settle the gantry at the test site. Similarly, automatic machine tool performance is improved by dynamically positioning a work tool at a work site during the gantry settling interval using a high performance secondary positioner to compensate for the inherent moving mass oscillational displacements.

Abstract: A system for probing both sides of a high density printed circuit board includes an open frame extending around the circuit board when it is held in a test position by a circuit board carrier. The frame includes two parallel rail structures extending above, and at opposite ends of, the circuit board in the test position. The frame also includes another two parallel rail structures extending below, and at opposite ends of, the circuit board. The upper and lower rail structures extend perpendicularly to one another, and are fastened together at the corners of the frame by means of compression bolt assemblies. Two gantry structures are moved in a first direction between the upper rail structures, while two other gantry structures are moved in a direction perpendicular to the first direction between the lower rail structures. A carriage moves along each gantry structure, and a probe is mounted on each carriage to be moved toward and away from the adjacent surface of the circuit board.

Abstract: Disclosed is a Probe Positioning Actuator which is low in cost and mass, capable of high accelerations, relatively long stroke and compact packaging, as well as high in efficiency. The actuator assembly comprises a frame, and at least one pair of spaced apart, laterally extending, conductor carrying, flexible beams attached to the frame. A non-magnetic armature, substantially U-shaped in cross section, is attached adjacent or approximate the extended terminal ends of the beams, and a probe is attached to the base of the "U" of the armature for contacting selected points in the electrical circuit associated with the device being tested. The heart of the actuator includes a coil mounted on the upstanding legs of the U-shaped armature and arranged so that the axis of the coil is perpendicular to the base of the armature but substantially parallel to the probe tip.

Abstract: A fixture is provided for locating open conditions within circuits and short conditions between adjacent circuits on a flexible substrate having circuits extending along each side, as well as individual circuits extending along both sides. In one station of the fixture, the flexible circuit extends against a conductive backing plate, and conductivity measurements, to detect open conditions, are made between two probes moving among test points on the first side of the substrate, which is opposite the backing plate, and between one of these probes and the conductive backing plate. The latter type of measurement is used particularly to detect an open condition in a via extending through the substrate.

Abstract: A method and apparatus for testing circuit boards uses a pair of probes to contact the various nodes on the circuit board. A single one of the pair of probes may be used to deposit a charge at a being tested net and checking for the presence of a charge at subsequent nets to determine whether a short condition exists. Moreover, the pair of probes is used to contact two nodes of a network being tested to measure the resistance within the network being tested; the measured resistance being compared to a nominal resistance, to determine whether an open condition exists. In addition, the pair of probes may be used to measure the resistance between networks in order to verify or determine whether a short condition exists between networks.