Abstract: A reconstituted wafer product may include dies containing diamond sandwiched between first and second wafers in a manner that provides a thermally conductive connection between the first wafer and second wafer through the dies containing diamond. Alternatively, dies containing diamond may be attached to a tape in frame or temporary carrier substrate or tape on reel carrier substrate. Alternatively, dies containing diamond may be attached to a wafer in a manner that provides a thermally conductive connection between the wafer and the dies containing diamond. A first smoothening layer may be formed on a first side of the dies between the wafer and the dies. A second smoothening layer may be formed on a second side of the dies with the dies containing sandwiched between the first and second smoothening layers.

Abstract: A reconstituted wafer product includes diamond dies sandwiched between a first wafer and a second wafer in a manner that provides a thermally conductive connection between the first wafer and second wafer through the diamond dies. At least one of the first wafer and second wafer includes pockets containing one or more diamond dies. An alternative reconstituted wafer product may include diamond dies attached to a silicon wafer in a manner that provides a thermally conductive connection between the wafer and the diamond dies, wherein the silicon wafer is bonded to the dies in areas that include one or more areas of recrystallized silicon.

Abstract: A low thermal resistance device package and heatsink assembly may include a device package containing one or more logic elements with the logic elements thermally connected to one or more diamond dies in a manner that provides a thermally conductive connection between the logic elements through the one or more diamond dies and one or more heatsinks. Each heatsink contains one or more chambers configured for a fluid heat transfer medium. A reconstituted wafer product may include a plurality of diamond dies attached to at least a first wafer in a manner that provides a thermally conductive connection between the first wafer and the dies containing diamond. The first wafer may be a 300 millimeters sized wafer and the diamond dies may include four sector dies arranged in four sectors of the 300 millimeters sized wafer.

Abstract: A reconstituted wafer product may include a plurality of die structures bonded to a wafer in a manner that provides a thermally conductive connection between the wafer and the plurality of die structures. The wafer is compatible with semiconductor processing. Each die structure may include a die containing diamond bonded to a heatsink-side surface of the wafer. Two or more dies containing diamond in the plurality of die structures are of different thickness.

Abstract: Methods of and devices for forming edge chamfers and through holes and slots on a material that is machined using a laser, such as an ultrafast laser. The shaped material has predetermined and highly controllable geometric shape and/or surface morphology. Further, a method of and a device for preventing re-deposition of the particles on a material that is machined using a laser, such as an ultrafast laser. A fluid is used to wash off the particles generated during the laser machining process. The fluid can be in a non-neutral condition, with one or more chemical salts added, or a condition allowing the coagulation of the particles in the fluid, such that the particles can be precipitated to avoid the reattachment to the machined substrate.

Abstract: Methods of and devices for forming edge chamfers and through holes and slots on a material that is machined using a laser, such as an ultrafast laser. The shaped material has predetermined and highly controllable geometric shape and/or surface morphology. Further, a method of and a device for preventing re-deposition of the particles on a material that is machined using a laser, such as an ultrafast laser. A fluid is used to wash off the particles generated during the laser machining process. The fluid can be in a non-neutral condition, with one or more chemical salts added, or a condition allowing the coagulation of the particles in the fluid, such that the particles can be precipitated to avoid the reattachment to the machined substrate.

Abstract: Methods of and devices for forming edge chamfers and through holes and slots on a material that is machined using a laser, such as an ultrafast laser. The shaped material has predetermined and highly controllable geometric shape and/or surface morphology. Further, a method of and a device for preventing re-deposition of the particles on a material that is machined using a laser, such as an ultrafast laser. A fluid is used to wash off the particles generated during the laser machining process. The fluid can be in a non-neutral condition, with one or more chemical salts added, or a condition allowing the coagulation of the particles in the fluid, such that the particles can be precipitated to avoid the reattachment to the machined substrate.

Abstract: The method of and device for cutting brittle materials with tailored edge shape and roughness are disclosed. The methods can include directing one or more tools to a portion of brittle material causing separation of the material into two or more portions, where the as-cut edge has a predetermined and controllable geometric shape and/or surface morphology. The one or more tools can comprise energy (e.g., a femtosecond laser beam or acoustic beam) delivered to the material without making a physical contact.

Abstract: Methods and systems for use during laser-scribing of a workpiece are provided. Some of the methods and systems provided use an imaging device to control the formation of a laser-scribed feature so as to more closely align with a previously-formed feature. Some of the methods and systems provided use an imaging device for inspection of a laser-scribed feature and/or process control. Some of the methods and systems provided use an imaging device to detect and avoid a workpiece defect during the formation of a laser-scribed feature.

Abstract: A stacked jack multi-port shielded and magnetically conditioned connector assembly is provided for assembly in three distinct configurations. In one configuration where power over ethernet is not required, the connector assembly has modular jack terminals which are directly connected to a motherboard. In a second configuration, the connector assembly can receive conditioned and controlled electrical signals to the connector, whereby power over ethernet may be provided through designated ones of the modular jack terminals. In a third configuration, the connector assembly is configured for an integrated power over ethernet card, whereby the device is provided as an integrated assembly.

Abstract: A system for machining a workpiece to desired finished workpiece specifications. The system comprises a system for producing a laser beam; a system for positioning the workpiece relative to the laser beam; a system for measuring the topography of the work piece and producing workpiece topography data; and a computer and control system operatively connected to the system for producing a laser beam, to the system for positioning the workpiece relative to the laser beam, and to the system for measuring the topography of the work piece and producing workpiece topography data. The computer and control system compares the workpiece topography data with the desired finished workpiece specifications and controls the system for positioning the workpiece relative to the laser beam so that the workpiece is moved with respect to the laser beam in a desirable fashion, within certain velocity, acceleration, and distance constraints.

Abstract: A stacked jack multi-port shielded and magnetically conditioned connector assembly is provided for assembly in three distinct configurations. One configuration is where power over ethernet is not required, but rather modular jack contacts are directly connected to a motherboard. A second configuration, the connector assembly can be configured to be enabled to receive conditioned and controlled electrical signals to the connector, whereby power over ethernet may be provided through designated ones of the modular jack contacts. Alternatively, the connector can be configured for an integrated power over ethernet card, where the device is provided as an integrated assembly.

Abstract: A laser drilling apparatus comprising an apparatus for emitting a plurality of laser pulses, an apparatus for deflecting the plurality of laser pulses at a part, an apparatus for positioning the part for receiving the plurality of laser pulses, and an apparatus for controlling the deflection apparatus and the positioning apparatus to drill a shaped hole in the part.

Abstract: An electrical module assembly configured for latching engagement with a receptacle assembly adapted for mounting to a printed circuit board includes a release mechanism having at least one actuator arm adapted to extend longitudinally along a respective one of opposite side walls of the receptacle assembly, and the actuator arm includes an ejector tab extending longitudinally therewith. A pivotally mounted bail is selectively positonable between a latched position and an unlatched position, and the bail engages the actuator arm and longitudinally pulls the actuator arm to release the ejector tab from the receptacle assembly.

Abstract: A lever-style de-latch mechanism for a pluggable electronic module, such as an SFP MSA fiber optic transceiver or other pluggable optoelectronic or electronic module. The mechanism is easily accessible to an operator and does not require any tools to operate. The mechanism uses rotational motion of a lever about a horizontal axis transverse to a horizontal direction of elongation of a module, or about a vertical axis (relative to a module extending in a horizontal plane), to cause translational motion of the de-latch actuator. Mechanisms including both T and bail latch style levers are provided. The lever may be adjacent to, or extend beyond, the front/face of the module's housing for tool-free accessibility and operation. The mechanism may allow the user to apply force to actuate the mechanism in a direction that does not oppose a withdrawal and/or module ejection force.