Patents by Inventor Michael Shover

Michael Shover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12457701
    Abstract: A connection clamp assembly and an electrical system including a connection clamp assembly are disclosed. The connection clamp assembly includes a rigid clamp portion with one or more protrusions configured to mechanically secure one or more electrical leads of an electronic device to one or more electrical connection points on a printed circuit board assembly forming an electrical connection. One or more fasteners pass through the rigid clamp portion and are configured to couple the connection clamp assembly to the printed circuit board assembly. A lid elastic element is received by the rigid clamp portion and is configured to elastically press on the electronic device, mechanically and thermally coupling the electronic device to the printed circuit board assembly.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: October 28, 2025
    Assignee: Advanced Energy Industries, Inc.
    Inventors: Jon Danielson, Courtney Crandell, Michael Shover, Steven Lawless
  • Publication number: 20220115797
    Abstract: A connection clamp assembly and an electrical system including a connection clamp assembly are disclosed. The connection clamp assembly includes a rigid clamp portion with one or more protrusions configured to mechanically secure one or more electrical leads of an electronic device to one or more electrical connection points on a printed circuit board assembly forming an electrical connection. One or more fasteners pass through the rigid clamp portion and are configured to couple the connection clamp assembly to the printed circuit board assembly. A lid elastic element is received by the rigid clamp portion and is configured to elastically press on the electronic device, mechanically and thermally coupling the electronic device to the printed circuit board assembly.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 14, 2022
    Inventors: Jon Danielson, Courtney Crandell, Michael Shover, Steven Lawless