Patents by Inventor Michael Sielaff

Michael Sielaff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10283432
    Abstract: A method of manufacturing a package, wherein the method comprises a forming a chip carrier by covering a thermally conductive and electrically insulating core on both opposing main surfaces thereof at least partially by a respective electrically conductive layer by brazing the respective electrically conductive layer on a respective one of the main surfaces; a mounting at least one electronic chip on the chip carrier; an electrically coupling an electrically conductive contact structure with the at least one electronic chip; and an encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip by a mold-type encapsulant.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: May 7, 2019
    Assignee: Infineon Technologies AG
    Inventors: Mark Pavier, Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere, Marco Sobkowiak
  • Publication number: 20190006260
    Abstract: A method of manufacturing a package, wherein the method comprises a forming a chip carrier by covering a thermally conductive and electrically insulating core on both opposing main surfaces thereof at least partially by a respective electrically conductive layer by brazing the respective electrically conductive layer on a respective one of the main surfaces; a mounting at least one electronic chip on the chip carrier; an electrically coupling an electrically conductive contact structure with the at least one electronic chip; and an encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip by a mold-type encapsulant.
    Type: Application
    Filed: August 24, 2018
    Publication date: January 3, 2019
    Inventors: Mark PAVIER, Wolfram HABLE, Angela KESSLER, Michael SIELAFF, Anton PUGATSCHOW, Charles RIMBERT-RIVIERE, Marco SOBKOWIAK
  • Patent number: 10074590
    Abstract: A package which comprises a chip carrier, at least one electronic chip mounted on the chip carrier, an electrically conductive contact structure electrically coupled with the at least one electronic chip, and a mold-type encapsulant encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip, wherein the chip carrier comprises a thermally conductive and electrically insulating core covered on both opposing main surfaces thereof by a respective brazed electrically conductive layer.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: September 11, 2018
    Assignee: Infineon Technologies AG
    Inventors: Mark Pavier, Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere, Marco Sobkowiak
  • Publication number: 20180146566
    Abstract: A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.
    Type: Application
    Filed: December 29, 2017
    Publication date: May 24, 2018
    Inventors: Patrick Jones, Christoph Koch, Michael Sielaff
  • Patent number: 9888601
    Abstract: A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: February 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Patrick Jones, Christoph Koch, Michael Sielaff
  • Publication number: 20160113123
    Abstract: A method for soldering a circuit carrier to a carrier plate includes providing a carrier plate having an upper side and a first adjusting device, providing a circuit carrier having an underside and a second adjusting device, providing a solder and placing the circuit carrier onto the carrier plate in such a way that: the underside of the circuit carrier faces the upper side of the carrier plate; the solder is arranged between the carrier plate and the circuit carrier; and the first adjusting device forms a stop for the second adjusting device that limits a displacement of the circuit carrier placed on the carrier plate along the upper side of the carrier plate. After placing the circuit carrier onto the carrier plate, the solder is melted and subsequently cooled down until it solidifies and connects the circuit carrier to the carrier plate in a material-bonding manner at a lower metallization layer.
    Type: Application
    Filed: October 19, 2015
    Publication date: April 21, 2016
    Inventors: Patrick Jones, Christoph Koch, Michael Sielaff
  • Patent number: 8979578
    Abstract: An electrical connector for transmitting data signals between the insulated conductors of a first data cable and corresponding insulated conductors of a second data cable, including a first part having a socket shaped to at least partially receive a plug of said first data cable; a second part having a plurality of insulation displacement contact slots shaped to receive end sections of the conductors of the second data cable; and a plurality of electrically conductive contacts including resiliently compressible spring finger contacts extending into the socket for electrical connection with corresponding conductors of the first cable; insulation displacement contacts seated in corresponding insulation displacement contact slots for effecting electrical connection with corresponding conductors of the second data cable; and mid sections extending therebetween, wherein relative movement between the mid sections of the contacts is inhibited by a fastener.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: March 17, 2015
    Assignee: ADC GmbH
    Inventors: Jason Allan Hogue, Michael Sielaff
  • Patent number: 8934750
    Abstract: The invention relates to a holder (1) for at least one cassette, with the holder (1) having at least one shaft holder (100), at least one shaft element (200, 250) and at least one cassette, with the at least one cassette being attached to the shaft element (200, 250) such that it can pivot about a pivoting axis, with the at least one shaft element (200, 250) being attached to the shaft holder (100), with the at least one shaft element (200, 250) having a guidance channel (212, 212a; 253, 253a; 254, 254a), with the guidance channel (212, 212a; 253, 253a; 254, 254a) running at least partially parallel to the pivoting axis, with the cassette having at least one element (515, 515a) for rotatable mounting, wherein at least one element (515, 515a) is mounted, for rotatable mounting, such that it can rotate on the at least one shaft element (200, 250).
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: January 13, 2015
    Assignee: Tyco Electronics Services GmbH
    Inventors: Adrian Benedetto, Oliver Hartmann, Frank Mössner, Michael Sielaff, Thomas Fischer
  • Patent number: 8921693
    Abstract: A box (1) for accommodating and laying optical waveguides and/or copper conductors includes at least one housing (10) and at least one cover (20). The cover (20) is attached to the housing (10) such that it can pivot and can be detached. The cover (20) has at least one receptacle for a pin element (90). The housing (10) has at least one pin element (90). The at least one pin element (90) can be displaced parallel to a pivot axis relative to the holding element (80) to move into and out of the receptacle.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: December 30, 2014
    Assignee: Tyco Electronics Services GmbH
    Inventors: Adrian Benedetto, Oliver Hartmann, Frank Mössner, Michael Sielaff, Thomas Fischer
  • Publication number: 20140204536
    Abstract: A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.
    Type: Application
    Filed: January 22, 2014
    Publication date: July 24, 2014
    Inventors: Patrick Jones, Christoph Koch, Michael Sielaff
  • Patent number: 8509586
    Abstract: The invention relates to a terminal box (1) for fiberoptic cables, comprising an at least two-part housing with a lower part (3) and a cover (2), the cover (2) being arranged pivotably on the lower part (3), at least one receptacle for a splice, at least one feed (10) for a fiberoptic cable and a receptacle (11) for a coupling, the side faces (5, 6) of the cover (2) being longer than the end faces (7, 8) of the cover (2), a pivot bearing of the cover (2) being arranged on an end face (8) of the cover (2), and to a panel for accommodating a terminal box (1) for fiberoptic cables.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: August 13, 2013
    Assignee: ADC GmbH
    Inventors: Jörg Adomeit, Oliver Hartmann, Ulrich Hetzer, Pia Kopf, Frank Mössner, Michael Sielaff
  • Publication number: 20130098677
    Abstract: The invention relates to a box (1) for accommodating and laying optical waveguides and/or copper conductors, with the box (1) comprising at least one housing (10) and at least one cover (20), with the cover (20) being attached to the housing (10) such that it can pivot, with the cover (20) being attached to the housing (10) such that it can be detached, with the cover (20) having at least one receptacle for a pin element (90), with the housing (10) having at least one pin element (90), it being possible for the at least one pin element (90) to be held by means of the receptacle for a pin element (90), and it being possible for the at least one pin element (90) to be displaced parallel to a pivot axis relative to the holding element (80).
    Type: Application
    Filed: November 2, 2010
    Publication date: April 25, 2013
    Applicant: Tyco Electronics Services GmbH
    Inventors: Adrian Benedetto, Oliver Hartmann, Frank Mössner, Michael Sielaff, Thomas Fischer
  • Publication number: 20120301098
    Abstract: The invention relates to a holder (1) for at least one cassette, with the holder (1) having at least one shaft holder (100), at least one shaft element (200, 250) and at least one cassette, with the at least one cassette being attached to the shaft element (200, 250) such that it can pivot about a pivoting axis, with the at least one shaft element (200, 250) being attached to the shaft holder (100), with the at least one shaft element (200, 250) having a guidance channel (212, 212a; 253, 253a; 254, 254a), with the guidance channel (212, 212a; 253, 253a; 254, 254a) running at least partially parallel to the pivoting axis, with the cassette having at least one element (515, 515a) for rotatable mounting, wherein at least one element (515, 515a) is mounted, for rotatable mounting, such that it can rotate on the at least one shaft element (200, 250).
    Type: Application
    Filed: November 2, 2010
    Publication date: November 29, 2012
    Applicant: Tyco Electronics Services GmbH
    Inventors: Adrian Benedetto, Oliver Hartmann, Frank Mössner, Michael Sielaff, Thomas Fischer
  • Patent number: 8313338
    Abstract: An electrical connector for transmitting data signals between the insulated conductors of a first data cable and corresponding insulated conductors of a second data cable, including a first part having a socket shaped to at least partially receive a plug of said first data cable; a second part having a plurality of insulation displacement contact slots shaped to receive end sections of the conductors of the second data cable; a plurality of electrically conductive contacts including resiliently compressible spring finger contacts extending into the socket for electrical connection with corresponding conductors of the first cable; insulation displacement contacts seated in corresponding insulation displacement contact slots for effecting electrical connection with corresponding conductors of the second data cable; and mid sections extending therebetween; and a plurality of capacitive plates coupled to a common point on respective ones of said mid sections of the contacts by electrically conductive stems, where
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: November 20, 2012
    Assignee: ADC GmbH
    Inventors: Jason Allan Hogue, Michael Sielaff
  • Patent number: 8272888
    Abstract: An electrical connector for transmitting data signals between the insulated conductors of a first data cable and corresponding insulated conductors of a second data cable, including a first part having a socket shaped to at least partially receive a plug of said first data cable; a second part having a plurality of insulation displacement contact slots shaped to receive end sections of the conductors of the second data cable; and a plurality of electrically conductive contacts including resiliently compressible spring finger contacts extending into the socket for electrical connection with corresponding conductors of the first cable; insulation displacement contacts seated in corresponding insulation displacement contact slots for effecting electrical connection with corresponding conductors of the second data cable; and mid sections extending therebetween, wherein mid sections of the contacts are seated in corresponding channels.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: September 25, 2012
    Assignee: ADC GmbH
    Inventors: Jason Allan Hogue, Michael Sielaff
  • Patent number: 8133069
    Abstract: An electrical connector for transmitting data signals between the insulated conductors of a first data cable and corresponding insulated conductors of a second data cable, including a socket shaped to at least partially receive a plug of said first data cable; a plurality of insulation displacement contact slots shaped to receive end sections of the conductors of the second data cable; a plurality of electrically conductive contacts including resiliently compressible spring finger contacts extending into the socket for electrical connection with corresponding conductors of the first cable; insulation displacement contacts seated in corresponding insulation displacement contact slots for effecting electrical connection with corresponding conductors of the second data cable; and mid sections extending therebetween; and a plurality of capacitive plates coupled to respective ones of said mid sections of the contacts by electrically conductive stems, wherein the capacitive plates are arranged side by side and exte
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: March 13, 2012
    Assignee: ADC GmbH
    Inventors: Jason Allan Hogue, Michael Sielaff
  • Patent number: 8075347
    Abstract: An electrical connector for transmitting data signals between the insulated conductors of a first data cable and corresponding insulated conductors of a second data cable, including a socket shaped to at least partially receive a plug of said first data cable; and a plurality of electrically conductive contacts including resiliently compressible spring finger contacts extending into the socket for electrical connection with corresponding conductors of the first cable, wherein one or more of the spring finger contacts have end sections having a first cross-sectional area, and one or more of the spring finger contacts have end sections having a second cross-sectional area that is less than that the first cross-sectional area.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: December 13, 2011
    Assignee: ADC GmbH
    Inventors: Jason Allan Hogue, Michael Sielaff
  • Patent number: 8068711
    Abstract: The invention relates to an adapter (1) for sleeves (20) with elastomer cable seals (28), comprising at least one tubular element (3) and a support element (2), the support element (2) comprising means for fastening the support element (2) to a lower housing part (21) of a sleeve (20) and to a method for introducing a fiber-optic cable into a sleeve (20) using an adapter (1).
    Type: Grant
    Filed: July 6, 2009
    Date of Patent: November 29, 2011
    Assignee: ADC GmbH
    Inventor: Michael Sielaff
  • Patent number: 8043095
    Abstract: An electrical connector (10) having a contact element (50) retained in a hollow body (12.) The body (12) has an internal socket structure (44) for receiving an end of the contact element (50) so that insulation displacement contacts (54) of this engage and make electrical connection to wires (70) of an incoming cable (16) to which the connector is connected. Fingers (56) of the connector element (50) extend externally of the connector body and carry electrical contacts (82).
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: October 25, 2011
    Assignee: ADC GmbH
    Inventors: Wayne Dennes, Michael Sielaff
  • Patent number: D762185
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: July 26, 2016
    Assignee: Infineon Technologies AG
    Inventors: Jutta Muehlensiep, Michael Sielaff