Patents by Inventor Michael Sleven

Michael Sleven has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor module with wireless saw temperature sensor
    Patent number: 8730681
    Abstract: A power semiconductor module includes a housing, a base plate disposed in the housing, a plurality of substrates mounted to the base plate, a plurality of power transistor die mounted to the substrates and a plurality of terminals mounted to the substrates and protruding through the housing. The terminals are in electrical connection with the power transistor die. The power semiconductor module further includes a wireless surface acoustic wave (SAW) temperature sensor disposed in the housing of the power semiconductor module.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 20, 2014
    Assignee: Infineon Technologies AG
    Inventor: Michael Sleven
  • POWER SEMICONDUCTOR MODULE WITH WIRELESS SAW TEMPERATURE SENSOR
    Publication number: 20130077222
    Abstract: A power semiconductor module includes a housing, a base plate disposed in the housing, a plurality of substrates mounted to the base plate, a plurality of power transistor die mounted to the substrates and a plurality of terminals mounted to the substrates and protruding through the housing. The terminals are in electrical connection with the power transistor die. The power semiconductor module further includes a wireless surface acoustic wave (SAW) temperature sensor disposed in the housing of the power semiconductor module.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Michael Sleven