Abstract: A system for correcting aberration and distortion in EUV lithography places a reticle on a deformable reticle chuck, and a reticle height sensor is used to measure the surface height of the reticle placed on the deformable reticle chuck. An optical system projects EUV radiation onto the reticle and collects and projects reflected EUV radiation from the reticle through its exit pupil onto a wafer placed on a wafer chuck. A deformable mirror disposed proximal to the exit pupil may also be controlled for this purpose. The deformable reticle chuck and the deformable mirror are controlled such that aberration and distortion of an image of the reticle formed on the wafer by the optical system are corrected based on the height measured by the reticle height sensor.

Abstract: A mirror is provided with throughholes, or channels, formed through its main body and a coolant pipe of a heat-conductive material is inserted in each of the channels for passing a cooling fluid inside. The outer wall of the coolant pipe does not contact the inner wall of the channel, and there is left a gap in between. The gap contains a heat-conducting gas such as helium. The gap is of a width of less than 100 ?m such that the gas has a high heat transfer coefficient even if its pressure is not too high. In some applications the gap may be filled with a heat-conductive fluid. It may be preferable, depending upon the circumstances, to form these channels proximally to the surface on which radiation is made incident. Additionally, the surface of the side of the mirror opposite the reflective side may be heated by auxiliary heat sources.

Abstract: A method and system for reducing displacements of a semiconductor wafer caused by thermal stresses during a fabrication process includes clamping the wafer to the multiple segments of a segmented chuck wherein the segmented chuck is capable of selectively clamping and unclamping regions of the semiconductor wafer, exposing a region of the wafer clamped to a segment of the chuck to an energy source during the fabrication process that causes thermal stress in the clamped region, unclamping the exposed region of the semiconductor wafer from the corresponding segment of the segmented chuck, and reclamping the exposed region of the semiconductor wafer to the segmented chuck as the thermal stresses of the exposed wafer region are relieved.

Abstract: A system for correcting aberration and distortion in EUV lithography places a reticle on a deformable reticle chuck, and a reticle height sensor is used to measure the surface height of the reticle placed on the deformable reticle chuck. An optical system projects EUV radiation onto the reticle and collects and projects reflected EUV radiation from the reticle through its exit pupil onto a wafer placed on a wafer chuck. A deformable mirror disposed proximal to the exit pupil may also be controlled for this purpose. The deformable reticle chuck and the deformable mirror are controlled such that aberration and distortion of an image of the reticle formed on the wafer by the optical system are corrected based on the height measured by the reticle height sensor.

Abstract: Mechanical control and actuation of an adaptive optical element provides highly stable and repeatable correction of the shape of an optical element to an accuracy of a small fraction of a very short wavelength of light, responsive to a metrology source and sensor arrangement. Actuators in the form of individual set-screws or other actuators capable of axially positioning a shaft are driven by a robotic screw driver with four degrees of freedom or one or more linear actuators to exert force on the mirror. Positive or negative force may be used for outward and/or inward deflection of the mirror. When a desired force is developed on the mirror through a mechanical linkage, the linkage may be clamped by a passive clamp which may be released by an actuator such that the adjustment is maintained while the linear actuator and the clamp actuator are turned off; yielding a highly stable adjustment while effectively removing sources of actuator drift, noise, vibration and heating which may adversely affect stability.

Abstract: An electrostatic pin chuck consisting of an annular array of gas inlets, located towards the periphery of the chuck, for providing a uniform distribution of cooling gas to a wafer held by the chuck. This uniform distribution of cooling gas results in a uniform transfer of heat from the wafer to the chuck. Two annular rims positioned towards the outer perimeter of the chuck, and separated by an annular array of vacuum pumpout ports connected through a manifold to a vacuum pump, help to prevent leakages of cooling gas by functioning as gas bearing seals. Varying the annular thickness of the inner and outer rim, vacuum pump pressure, and the space between the wafer and chuck all affect the leakage rate of cooling gas from the chuck.

Abstract: A method and system for reducing displacements of a semiconductor wafer caused by thermal stresses during a fabrication process includes clamping the wafer to the multiple segments of a segmented chuck wherein the segmented chuck is capable of selectively clamping and unclamping regions of the semiconductor wafer, exposing a region of the wafer clamped to a segment of the chuck to an energy source during the fabrication process that causes thermal stress in the clamped region, unclamping the exposed region of the semiconductor wafer from the corresponding segment of the segmented chuck, and reclamping the exposed region of the semiconductor wafer to the segmented chuck as the thermal stresses of the exposed wafer region are relieved.

Abstract: An apparatus and method for performing hybridization or binding assays under thermophoretic conditions is provided.

Abstract: A lens assembly for use with an electron beam optical system operating in a vacuum. The lens assembly includes a housing forming a sealed enclosure and at least one lens disposed within the housing. The housing includes a port for connection to a vacuum source for creating a vacuum in the sealed enclosure. A method of creating a vacuum within the lens assembly is also disclosed.

Abstract: An electrostatic pin chuck consisting of an annular array of gas inlets, located towards the periphery of the chuck, for providing a uniform distribution of cooling gas to a wafer held by the chuck. This uniform distribution of cooling gas results in a uniform transfer of heat from the wafer to the chuck. Two annular rims positioned towards the outer perimeter of the chuck, and separated by an annular array of vacuum pumpout ports connected through a manifold to a vacuum pump, help to prevent leakages of cooling gas by functioning as gas bearing seals. Varying the annular thickness of the inner and outer rim, vacuum pump pressure, and the space between the wafer and chuck all affect the leakage rate of cooling gas from the chuck.

Abstract: A system and methods for generating a variable rate filtered output using synchronous filters having the same filter sampling time, that avoids complexities of asynchronous filters. A system employs multiple filters that are staggered in time and set so that the output of one of the multiple filters is available whenever a secondary process requires state information. In another embodiment, the synchronous filters are programmable so as to change the filter sampling time. This configuration is possible when it is known that the prescribed time interval of the secondary process is longer than the filter sampling time and the prescribed time interval is an integer multiple of the filter sampling time. By using programmable filters, the number of filters required to accommodate a certain prescribed time interval can be minimized.

Abstract: A stage device comprising a base, a stage positioned adjacent to the base and movable relative to the base, and a bearing assembly. The bearing assembly includes at least one fluid bearing interposed between the base and the stage for supporting the stage on the base and movable relative to the base and stage. A method of the present invention is for positioning a stage within a lithography system and comprises placing the fluid bearing between the stage and the base and moving the stage and the bearing in a first direction.

Abstract: A debris containment shutter useable in a photolithography system comprises one or more moving members that sweep and/or deflect debris that is associated with plasma generated from a target away from the structures to be protected from the debris. The members may be configured as a structure that moves across the plasma space in which the debris populates, such as a rotating or reciprocating structure. For controlling debris associated with pulsed radiation, the movement of the members is synchronized with the pulses of plasma emitted radiation. In one aspect of the present invention, the shutter comprises a plate rotatable about an axis of rotation, the plate defining at least one opening therethrough and at least one member (e.g., in the form of baffles or vanes) extending from a surface of the plate. The members may extend radially outward from a hub or inward from a perimeter.

Abstract: A vacuum compatible, deformable electrostatic chuck with high thermal conductivity including a membrane having a layer of dielectric material, a layer of metallic film and a layer of semiconductor material with struts and a rim formed on the layer of semiconductor material. The rim is formed on the periphery of the layer of semiconductor material. The rim and struts contact a surface of a supporting structure forming a hollow area in which a coolant gas may be circulated. The supporting structure has gas manifold holes to connect the hollow area with a source of coolant gas. In a first embodiment, the struts have a rectangular cross section and are formed as a continuous structure from a first point on the rim to a second point on the rim. In a second embodiment, the struts are flexure struts having a first section with a rectangular cross section and a second section formed as a truncated cone or a pyramid.