Patents by Inventor Michael SPERBER

Michael SPERBER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210094424
    Abstract: A control apparatus for operating an electric drive for a vehicle may include one or more power modules, which have one or more power semiconductors; an intermediate circuit capacitor, which is connected in parallel to the power module(s); a cooler for dissipating heat generated by the power module(s); and an interconnect device for obtaining electrical contact to the power module(s), wherein the cooler extends over at least two main planes forming an angle to one another.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 1, 2021
    Applicant: ZF Friedrichshafen AG
    Inventors: Michael Sperber, Stefan Hain, ChandraGupta Hazarika
  • Publication number: 20210068310
    Abstract: A control apparatus for operating an electric drive for a vehicle may include one or more of the following: a plurality of power module, which has one or more power semiconductors; an intermediate circuit capacitor, which is connected in parallel to the power module; a cooler for dissipating heat generated by the power module; an interconnect device for obtaining electrical contact to the power module, where the interconnect device has a first section and a second section at an angle to the first section, and where the first section and the second section are each perpendicular to a main plane of the power module.
    Type: Application
    Filed: September 3, 2020
    Publication date: March 4, 2021
    Applicant: ZF Friedrichshafen AG
    Inventors: Stefan Hain, Michael Sperber
  • Publication number: 20210014999
    Abstract: A power electronics assembly comprises a heat sink, at least two half bridge modules mounted on one side of the heat sink, a circuit board mounted on the half bridge modules, and at least one capacitor mounted on the circuit boards, wherein each of the half bridge modules has a housing that has a cold side that is mounted on the heat sink, and the housing has a connection side from which numerous connection pins project for each DC connection in the half bridge module that are connected to the circuit board, and wherein conductors in the circuit board are designed to connect the half bridge modules in parallel and connect them to the at least one capacitor to form a DC link.
    Type: Application
    Filed: February 5, 2019
    Publication date: January 14, 2021
    Applicant: ZF Friedrichshafen AG
    Inventors: Marco DENK, Johannes HAGER, Michael SPERBER
  • Patent number: 10820408
    Abstract: A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: October 27, 2020
    Assignee: ZF Friedrichshafen AG
    Inventor: Michael Sperber
  • Publication number: 20200008293
    Abstract: A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.
    Type: Application
    Filed: February 6, 2018
    Publication date: January 2, 2020
    Applicant: ZF Friedrichshafen AG
    Inventor: Michael SPERBER
  • Patent number: 10375824
    Abstract: A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: August 6, 2019
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Michael Sperber, Wilfried Lassmann, Dirk Schramm
  • Patent number: 10334718
    Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: June 25, 2019
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Wilfried Lassmann, Michael Sperber
  • Publication number: 20180263111
    Abstract: A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer.
    Type: Application
    Filed: August 11, 2016
    Publication date: September 13, 2018
    Applicant: ZF Friedrichshafen AG
    Inventors: Michael Sperber, Wilfried Lassmann, Dirk Schramm
  • Publication number: 20160286639
    Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.
    Type: Application
    Filed: October 21, 2014
    Publication date: September 29, 2016
    Applicant: ZF Friedrichshafen AG
    Inventors: Wilfried LASSMANN, Michael SPERBER