Abstract: A thermal management circuit material comprises an electrically conductive layer; a dielectric layer comprising a polymer matrix and a thermally conductive, electrically non-conductive particulate filler, wherein the dielectric layer is disposed on and in at least partial contact with the electrically conductive layer, and wherein the circuit material has a thermal conductivity of greater than or equal to about 1 watt per meter-degree Kelvin.

Abstract: A process to produce a liquid crystalline polymer film comprises electrostatically depositing a fine powder of liquid crystalline polymer resin onto a carrier and fusing the deposited fine powder to form a liquid crystalline polymer film that is isotropic in the x-y plane. The electrostatic deposition of the resin particles results in a substantially random molecular alignment of the liquid crystalline polymer. The carrier can comprise an all metal foil, a metal foil laminate, a polymer film material, or a release material.

Abstract: A process to produce a liquid crystalline polymer film comprises electrostatically depositing a fine powder of liquid crystalline polymer resin onto a carrier and fusing the deposited fine powder to form a liquid crystalline polymer film that is isotropic in the x-y plane. The electrostatic deposition of the resin particles results in a substantially random molecular alignment of the liquid crystalline polymer. The carrier can comprise an all metal foil, a metal foil laminate, a polymer film material, or a release material.

Abstract: A method of making liquid crystalline polymer-copper laminates comprising laminating liquid crystalline polymer film to a copper foil wherein the copper foil has a surface concentration of zinc of less than or equal to about 2 atomic % and a surface concentration of chromium of less than or equal to about 4 atomic %, based on surface atomic concentration. Preferably the copper foil further comprises a dendritic layer. The copper foil may optionally be coated with a hydrophobic layer prior to lamination. The liquid crystalline polymer/copper laminate exhibits significantly improved bond strength retention compared to the prior art, particularly after being subjected to conditions of high humidity and temperature for 24 hours or more.

Abstract: Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.